tag: Diodes

Ultranarrow Semiconductor WS2 Nanoribbon FETs (Chalmers)
By Technical Paper Link - 29 Jan, 2025 - Comments: 0

A new technical paper titled "Ultranarrow Semiconductor WS2 Nanoribbon Field-Effect Transistors" was published by researchers at Chalmers University of Technology. Abstract "Semiconducting transition metal dichalcogenides (TMDs) have attracted significant attention for their potential to develop high-performance, energy-efficient, and nanoscale electronic devices. Despite notable advancem... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Mar, 2022 - Comments: 0

Packaging ASE, AMD, Arm, Google, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC have announced the formation of a consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem. The founding companies also ratified the UCIe specification, an open industry standard developed to establish a standard interconnect at the package level. The UCIe 1.0 s... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Jan, 2020 - Comments: 1

Chipmakers A fire broke out this week at a joint NAND flash fab between Western Digital (WD) and Kioxia. Kioxia is the former Toshiba NAND flash unit that was recently spun out by the Japanese company. “On Monday, January 6, (morning, January 7 local time) a small fire occurred at one of our joint venture facilities in Yokkaichi, Japan. Local firefighters quickly extinguished the fire, and w... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Sep, 2019 - Comments: 0

Chipmakers United Microelectronics Corp. (UMC) has satisfied all closing conditions for the full acquisition of Mie Fujitsu Semiconductor Ltd. (MIFS), the former 300mm wafer foundry joint venture between UMC and Fujitsu Semiconductor Ltd. (FSL). The completion of the acquisition is scheduled for Oct. 1. In 2014, FSL and UMC agreed for UMC to acquire a 15.9% stake in MIFS from FSL through pr... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Aug, 2019 - Comments: 0

Fab tools Lam Research has rolled out two new tools for use in the production of 3D NAND. The first tool, called the VECTOR DT, is geared for backside deposition. The second system, the EOS GS, is a wet etch tool for film removal on backside and bevel. Designed to control the wafer bow in 3D NAND manufacturing, the VECTOR DT system is the latest addition to Lam’s plasma-enhanced chemical ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Feb, 2019 - Comments: 0

Chipmakers and OEMs Diamond semiconductor IP vendor AKHAN Semiconductor is cooperating with a U.S. federal investigation into alleged theft of its intellectual property by China’s Huawei. When AKHAN agreed to send its proprietary technology to Huawei pursuant to an agreement, AKHAN “believes that Huawei destroyed our product, shipped it to China without authorization, subjected it to tests... » read more

Power/Performance Bits: Sept. 12
By Jesse Allen - 12 Sep, 2017 - Comments: 0

Water-based li-ion battery Researchers at the University of Maryland and the U.S. Army Research Laboratory developed a lithium-ion battery that uses a water-salt solution as its electrolyte and reaches the 4.0 volt mark desired for household electronics, without the fire and explosive risks associated with some commercially available non-aqueous lithium-ion batteries. The battery provides i... » read more

Manufacturing Bits: April 12
By Mark LaPedus - 12 Apr, 2016 - Comments: 0

Ink FETs The University of Pennsylvania has developed a new way to make chips by using nanocrystal inks. The devices, dubbed nanocrystal field-effect transistors (FETs), could be used one day to develop chips for flexible and wearable applications In the lab, researchers devised spherical nanoscale particles. These particles, which have electrical characteristics, were dispersed in a liquid... » read more

Power/Performance Bits: April 5
By Jesse Allen - 05 Apr, 2016 - Comments: 0

DNA diodes Researchers at the University of Georgia and at Ben-Gurion University in Israel created nanoscale electronic components from single DNA molecules. "For 50 years, we have been able to place more and more computing power onto smaller and smaller chips, but we are now pushing the physical limits of silicon," said Bingqian Xu, an associate professor in the UGA College of Engineerin... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Nov, 2015 - Comments: 0

At one time, China’s Xiaomi was a high-flying smartphone vendor. The privately-held company had a market capitalization of $45 billion. But the bottom has fallen out of the company amid share losses. “By early 2015, it was clear that problems were emerging as growth ground to a halt and nothing that Xiaomi has done since has been able to re-start it. Xiaomi has ground to halt because there ... » read more

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