Using DNA Differently

By Ernest Worthman - 03 Dec, 2015 - Comments: 0

As the Internet of Everything creeps closer and closer, technologies from wireless to biometrics are undergoing metamorphosis. On the biometrics front, there is a vast array of applications, from fingerprints to facial recognition—even finger vein recognition. But the one that is garnering a lot of attention these days is DNA sequencing, and a subset called rapid DNA sequencing. Both are b... » read more

10 Common Device Noise Analysis Mistakes

By Mentor, a Siemens Business - 28 Oct, 2015 - Comments: 0

Device noise is critical in nanometer-scale CMOS processes, and it fundamentally limits the performance of many circuits at 45 nm and below. Given the right tools, device noise analysis (DNA) is a fairly straightforward process that should produce results that are within 1 dB to 2 dB of silicon measurements. However, there are a number of common mistakes that can lead to grossly overestimating ... » read more

5 Technologies To Watch

By Mark LaPedus - 23 Jul, 2015 - Comments: 0

The industry is developing a dizzying array of new technologies. In fact, there are more new and innovative technologies than ever before. And the list is countless. At least from my vantage point, I have come up with my own list of the top five technologies to watch in 2015 and beyond. They are listed in alphabetical order. (See below). Obviously, there are more than just five technologi... » read more

Manufacturing Bits: July 7

By Mark LaPedus - 07 Jul, 2015 - Comments: 0

Silicon photonics prototyping A group of European and other research organizations have put the finishing touches on a project to help propel the development of silicon photonics into the commercial market. The project, dubbed ESSenTIAL, enables small- to mid-sized enterprises to develop prototypes and products based on silicon photonics. Funded by the European Commission, the project inclu... » read more

DNA For Cryptography Chips

By Ernest Worthman - 08 Jan, 2015 - Comments: 1

Counterfeit chips are here to stay. There are all kinds of reasons they should never be used, but certain segments of the chip market have more critical fallout from such chips than others. In most cases counterfeit chip use is unintentional. It simply goes undetected in the vast supply chain, sometimes with life-threatening repercussions. But whether in life-safety or low-end consumer produ... » read more

Manufacturing Bits: Dec. 23

By Mark LaPedus - 23 Dec, 2014 - Comments: 0

Higgs boson sensors At the recent 2014 IEEE International Electron Devices Meeting (IEDM) in San Francisco, CERN described the tiny hybrid pixel detectors used at the Large Hadron Collider (LHC). Using CMOS technology, hybrid pixel detectors identify and tag individual sub-atomic particles at fast speeds. CERN, the European Organization for Nuclear Research, is a particle physics laboratory... » read more

What’s Next For DNA Chips?

By Mark LaPedus - 11 Dec, 2014 - Comments: 0

The field of genomic personalized medicine is an emerging and promising area. Using lab systems called DNA sequencers, these units could provide vital information about an individual’s genetic makeup. In this area, several companies are developing next-generation DNA sequencers, built around CMOS-based semiconductor technology. But CMOS-based DNA sequencing chips, and the competing techno... » read more

Power/Performance Bits: Sept. 10

By Ann Mutschler - 10 Sep, 2013 - Comments: 0

Using DNA to assemble transistors from graphene Graphene is a sheet of carbon atoms arrayed in a honeycomb pattern, just a single atom thick. It could be a better semiconductor than silicon – if we could fashion it into ribbons 20 to 50 atoms wide. Could DNA help? Stanford chemical engineering professor Zhenan Bao, believes it could. Bao and her team of researchers hope to solve a problem... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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