How Digital Twins Are Unlocking The Next Era Of Aerospace And Government Applications

By Ian Land - 31 Oct, 2022 - Comments: 0

By Ian Land, Jason Niatas, and Marc Serughetti Amidst changing economic waters and stringent manufacturing cycles, the aerospace, defense, and government landscape has seen an impressive technological evolution in the last few years. Innovations such as automating mission-critical systems and deploying advanced electronics in deep space exploration are expanding opportunities for government ... » read more

Deliver DO-178C compliant software on budget and on schedule

By Synopsys - 03 Oct, 2018 - Comments: 0

Ensuring safety in civilian airborne software is an ongoing challenge in the increasingly software-intensive aviation industry, yet accidents and fatalities caused by software are nearly unheard of in civil aviation. This impressive track record is due largely to the DO-178 standard. However, successful DO-178C certification involves significant costs and timelines. To avoid cost overruns an... » read more

Toward Autonomous Farming

By Ann Mutschler - 03 May, 2018 - Comments: 0

While the automotive industry works diligently towards self-driving vehicles, it's possible the carrots you've eaten recently were semi-autonomously planted and harvested with Case IH equipment by Bolthouse Farms, one of the largest carrot growers in the United States. And the U.S. is hardly alone. Autonomous agriculture is coming everywhere, and it's happening much faster than autonomous ca... » read more

Embedded Software Verification Issues Grow

By Ann Mutschler - 08 Dec, 2016 - Comments: 0

Embedded software is becoming more critical in managing the power and performance of complex designs, but so far there is no consensus about the best way to approach it—and that's creating problems. Even with safety-critical standards such as DO-178C for aerospace and [gettech id="31076" comment="ISO 26262"] for automotive, different groups of tool providers approach software from differen... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: DO-178C

How Digital Twins Are Unlocking The Next Era Of Aerospace And Government Applications

Deliver DO-178C compliant software on budget and on schedule

Toward Autonomous Farming

Embedded Software Verification Issues Grow