ARM Buys Carbon

By Brian Bailey - 20 Oct, 2015 - Comments: 3

ARM acquired Carbon Design Systems and its staff for an undisclosed amount of money, adding virtual prototyping capabilities for ARM cores. The deal is the latest in an onslaught of mergers and acquisitions that have racked the semiconductor industry over the past 18 months, propelled by low interest rates and relatively low valuations of target companies. For ARM, this deal solves a growing... » read more

Fundamental Shifts In Chip Business

By Ed Sperling - 17 Aug, 2015 - Comments: 3

Shifting business models, acquisitions, minority investments and increasing uncertainty are creating fundamental shifts in the semiconductor industry that could redefine who is successful in which markets for years to come. The announcement today that [getentity id="22671" e_name="Rambus"] is developing memory controller chips, expanding its business beyond just creating IP for the memory an... » read more

Intel Acquires Docea Power

By Brian Bailey - 14 Aug, 2015 - Comments: 0

Intel has quietly done another EDA acquisition, this time buying Docea Power, a small company based in Moirans, France. Docea had high-level power and thermal estimation tools. The acquisition closed July 31st. [getentity id="22222" comment="Docea Power"] was founded by two brothers, [getperson id="11137" p_name="Ghislain"] and [getperson id="11138" p_name="Sylvian"] Kaiser. Ghislain had spe... » read more

Rethinking Power

By Ed Sperling - 14 May, 2015 - Comments: 0

Power typically has been the last factor to be considered in the PPA equation, and it usually was somebody else's problem. Increasingly it's everyone's problem, and EDA companies are beginning to look at power differently than in the past. While the driving forces vary by market and by process node, the need to save energy at every node and in almost all designs is pervasive. In the server m... » read more

Thermal Is Still Simmering

By Ann Mutschler - 12 Mar, 2015 - Comments: 0

With the ever increasing sophistication in today’s high-performance [getkc id="81" kc_name="SoC"]s on top of sheer physics of device manufacturing, thermal is a much bigger concern than ever before. It is well understood that thermal and power are closely related, and there exists a vicious cycle between leakage power and temperature: leakage goes up, temperature goes up; temperature goes ... » read more

Important Changes Ahead

By Steve Schulz - 12 Jan, 2015 - Comments: 0

Two of Si2's important industry standards efforts will be featured later this month at DesignCon, a popular Silicon Valley event that is now in its 20th year. In the panel entitled, "System-Level Power Modeling—What's the Big Deal?", leading industry experts from AMD, Avago Technologies, Cadence, Docea Power, Qualcomm, and Si2 will focus on the growing need to take a higher level and more... » read more

Are More Processor Cores Better?

By Brian Bailey - 06 Nov, 2014 - Comments: 0

Up until the early 2000s, each generation of processor was faster, used more exotic architectures, had deeper pipelines, used more transistors, ran at higher clock frequencies and consumed more power. In fact power was rising faster than performance and led to the extrapolation that within a few generations, processors would run as hot as nuclear reactors. Something had to change, and that c... » read more

After Moore’s Law: More With Less

By Brian Bailey - 10 Jul, 2014 - Comments: 6

In the decades when Moore’s Law went unquestioned, the industry was able to migrate to the next smaller node and receive access to more devices that could be used for increased functionality and additional integration. While less significant transistor-level power savings have been seen from the more recent nodes, as leakage currents have increased, the additional levels of integration have b... » read more

Making Modeling Less Unpleasant

By Brian Bailey - 19 Dec, 2013 - Comments: 1

How many times did your mother tell you to take your medicine? You knew two things: a) it would be unpleasant and b) it would be worth the few seconds of unpleasantness because of the benefits it would provide. It appears as if the electronics industry has the same issue with modeling. We talk about the benefits that having a system-level model would have — the ability to explore system archi... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Docea Power

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