tag: Docea Power

The Rise Of The Power Architect
By Ed Sperling - 09 Aug, 2012 - Comments: 0

By Ann Steffora Mutschler Call them power czars, power gurus or power architects, this role within design teams is gaining importance with the need to understand, manage and control the power budget throughout the entire design process. As such, power architects are in high demand today with power architecture teams doubling in size within a year or two. Driving the need for this highly s... » read more

Bubble Gum and Scotch Tape
By Ann Mutschler - 12 Jul, 2012 - Comments: 0

It’s always extremely interesting to talk with actual design engineers, trudging through the trenches of challenges like 3D design. Recently, I was able to speak with Robert Patti, chief technology officer, vice president of design engineering and a director at Tezzaron Semiconductor. The company has been putting 3D designs together for quite some time so I expected to hear that they are u... » read more

Power Shift
By Ed Sperling - 14 Jun, 2012 - Comments: 0

By Ed Sperling For the past decade, most of the real gains in energy efficiency were developed for chips inside mobile electronics because of the demand for longer battery life. Dark silicon now represents the majority of mobile devices, multiple power islands are commonplace to push many functions into deep sleep, and performance is usually the secondary concern for most applications. Whil... » read more

Power Modeling: Use Cases Need to be Clearly Defined
By Ann Mutschler - 14 Jun, 2012 - Comments: 0

By Ann Steffora Mutschler Low-Power/High-Performance Engineering sat down to discuss power modeling during the Design Automation Conference with Vic Kulkarni, senior vice president and general manager at Apache Design; Paul Martin, design enablement and alliances manager at ARM; Sylvan Kaiser, CTO at Docea Power; and Frank Schirrmeister, group director, product marketing for system deve... » read more

New Power Standards Ahead
By Ed Sperling - 10 May, 2012 - Comments: 0

By Ed Sperling Standards groups are beginning to look at power and other physical effects much more seriously in the wake of the dueling power formats—UPF and CPF—that have caused angst across the design industry. To put it in perspective, when CPF and UPF were first introduced power was something of an afterthought in design. At 65nm it ceased to be something that could be dealt with l... » read more

ESL Power Models
By Ed Sperling - 10 May, 2012 - Comments: 0

Low-Power Engineering discusses what's missing from the ESL tool chain with Ghislain Kaiser, CEO of Docea Power. [youtube vid=hV5viEgLIvA] » read more

Power Becomes Bigger Issue In Stacked Die
By Ed Sperling - 10 May, 2012 - Comments: 0

By Ed Sperling Concern over getting the heat out of stacked die is well defined, even if the current raft of existing and proposed solutions ranges from ineffective to exotic and expensive. What is less well understood is how to plan for and manage power inside of stacked die. While power and heat frequently go hand in hand—where there is heat there is almost always power dissipation—t... » read more

Getting Ready For Stacked Die
By Ed Sperling - 05 Apr, 2012 - Comments: 0

By Ed Sperling The move toward stacking of die has always been a series of disconnected pieces and vague promises for the future, but in the past few months the scenario has changed radically—and so has the commentary. All three of the Big Three EDA vendors now have at least some of the pieces in place for 2.5D stacking and are working on a full 3D flow. Two of the biggest FPGA vendors, A... » read more

The Trouble With Power Models
By Ed Sperling - 08 Mar, 2012 - Comments: 0

By Ed Sperling Talk with any large systems vendor about power modeling and, with very few exceptions, they’re still using a mix of spreadsheets and lower-level models—no matter how far along they are in ESL adoption and in modeling other parts of an IC. Power has crept up on even the biggest companies, which have never really figured out how to implement it into their design flows. For ... » read more

Pathfinding For Power And Heat
By Ed Sperling - 02 Mar, 2012 - Comments: 0

By Ed Sperling There are many ways to measure power and heat in an IC, and each one of them adds tremendous value to a design. But there are still holes, and those holes are just beginning to get filled. Power and heat have emerged as two of the most persistent problems in advanced designs, and there is no single or simple way to tackle either of them. Nevertheless, there is at least progre... » read more

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