Week In Review: Manufacturing, Test


Chipmakers SMIC’s shares fell following the resignation of the company co-CEO, according to a report from Bloomberg. Liang Mong Song, co-CEO of the Chinese foundry company, has proposed to resign and the company has become aware of Liang’s intention of conditional resignation, according to a filing. A former technologist at TSMC and Samsung, Liang has opposed the appointment of a new board... » read more

Security Gaps In Open Source Hardware And AI


Semiconductor Engineering sat down to discuss security risks across multiple market segments with Helena Handschuh, security technologies fellow at Rambus; Mike Borza, principal security technologist for the Solutions Group at Synopsys; Steve Carlson, director of aerospace and defense solutions at Cadence; Alric Althoff, senior hardware security engineer at Tortuga Logic; and Joe Kiniry, princi... » read more

Emerging Apps And Challenges For Packaging


Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Disaggregation And Smarter Chips Shift Liability For Security


Semiconductor Engineering sat down to discuss security on chips with Vic Kulkarni, vice president and chief strategist at Ansys; Jason Oberg, CTO and co-founder of Tortuga Logic; Pamela Norton, CEO and founder of Borsetta; Ron Perez, fellow and technical lead for security architecture at Intel; and Tim Whitfield, vice president of strategy at Arm. What follows are excerpts of that conversation,... » read more

Week In Review: Manufacturing, Test


Trade and government The U.S. continues to tighten its export controls for hi-tech, including a move to restrict fab technologies that enable 5nm chip production. The U.S. Department of Commerce has imposed controls on six more technologies, bringing the total to 37. They include: hybrid additive manufacturing/computer controlled tools; computational lithography software designed for EUV masks... » read more

Manufacturing Bits: Oct. 27


Single-molecule switches A group of researchers have demonstrated a single-molecule switch or electret, a technology that could one day enable a new class of non-volatile memory storage devices. Yale University, Nanjing University, Renmin University, Xiamen University, and the Rensselaer Polytechnic Institute have demonstrated a single-molecule electret with functional memory. Still in ... » read more

Regaining The Edge In U.S. Chip Manufacturing


The United States is developing new strategies to prevent it from falling further behind Korea, Taiwan, and perhaps even China in semiconductor manufacturing, as trade tensions and national security concerns continue to grow. For years, the U.S. has been a leader in the development of new chip products like GPUs and microprocessors. But from a chip manufacturing standpoint, the U.S. is losin... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Intel is exiting the NAND flash market. SK Hynix and Intel announced that they have signed an agreement on Oct. 20, under which SK Hynix would acquire Intel’s NAND memory and storage business for $9 billion.The transaction includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain it... » read more

Week In Review: Manufacturing, Test


Top story NVIDIA and SoftBank Group Corp. (SBG) have announced a definitive agreement under which NVIDIA will acquire Arm from SBG and the SoftBank Vision Fund in a transaction valued at $40 billion. Market research Here’s the latest fab equipment forecast from VLSI Research: “The semiconductor equipment market has been very resilient in 2020 despite a very challenging macroeconomic ... » read more

Far Out AI In Remote Locations


There really isn’t anything that you can do on Earth with electronics that you can’t do in space, but it certainly can be a lot harder and take longer to fix is something goes wrong. And as more intelligent electronics are launched into space, the concern over potential failures is growing. AI inferencing has been pushing out further for some time, and it is starting to redefine what con... » read more

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