tag: DRAM

DDR White Paper
By Various Writers - 12 Sep, 2013 - Comments: 0

DDR DRAM memory controllers have many competing demands on them. A good memory controller must improve the bandwidth of the memory interface while respecting the latency demands of the CPU, graphics, and real-time DRAM in the system while maintaining compliance with memory bus and on-chip bus standards. The read reorder buffer (RRB) is a silicon-proven architectural enhancement available in... » read more

DRAM Remains The Status Quo
By Frank Ferro - 22 Aug, 2013 - Comments: 0

By Frank Ferro No one will argue that the “post-PC” era is here. Tablet shipments are expected to pass laptops by the end of this year, and desktops by the end of 2015. Add-in the nearly 1 billion smartphones shipment projected for 2013, and you would think that the DRAM industry would take notice of this volume. DRAM manufacturers do care about this segment of the market, but this fact... » read more

Memory Architectures Undergo Changes
By Ed Sperling - 22 Aug, 2013 - Comments: 0

By Ed Sperling Memory architectures are taking some new twists. Fueled by multi-core and multiple processors, as well as some speed bumps using existing technology, SoC makers are beginning to rethink how to architect, model and assemble memory to improve speed, lower power and reduce cost. What’s unusual about all of this is that it doesn’t rely on new technology, although there certai... » read more

The Week In Review: Aug. 19
By Mark LaPedus - 19 Aug, 2013 - Comments: 0

By Mark LaPedus Applied Materials named Gary Dickerson, who has been serving as president of the company, as CEO. Mike Splinter, who held the reins since 2003, was elevated to executive chairman of the board. Dickerson served as the CEO of Varian, which Applied acquired in 2011, as well as the president and COO of KLA-Tencor. Applied Materials also announced its Q3 results. The company rep... » read more

ATE Market Changes With The Times
By Jeff Chappell - 15 Aug, 2013 - Comments: 0

By Jeff Chappell A declining PC market in recent years coupled with the continuing growth of mobile phones and tablets has meant changes throughout the semiconductor supply chain, and automated test equipment is no exception. For example, a decade ago memory test—namely DRAM—was a large market compared with that of nascent system-on-a-chip (SoC) testing. In fact, at the time some test e... » read more

Mixing Custom And Standard Parts
By Ed Sperling - 08 Aug, 2013 - Comments: 0

By Ed Sperling The amount of third-party and re-used IP content in an SoC is on the rise, but once a decision to buy vs. make has been made it doesn’t always stay that way. In fact, chipmakers are swinging the pendulum back and forth across a variety of chips, building IP themselves, standardizing on another vendor’s IP, then sometimes rolling it back the other way. The reasons are usua... » read more

The Week In Review: July 22
By Mark LaPedus - 22 Jul, 2013 - Comments: 0

By Mark LaPedus ASML Holding has been under pressure to bring extreme ultraviolet (EUV) lithography into mass production. EUV is still delayed. Now, in their latest roadmaps, leading-edge chipmakers are counting on ASML’s 300mm EUV scanner for insertion at the 10nm node. Yet, at the same time, ASML also is working on a 450mm version of the EUV tool. “EUV (on 300mm) is a higher priority th... » read more

Memory Gets Smarter
By Ed Sperling - 27 Jun, 2013 - Comments: 0

By Ed Sperling Look inside any complex SoC these days and the wiring congestion around memory is almost astounding. While the number of features on a chip is increasing, they are all built around the same memory modules. Logic needs memory, and in a densely packed semiconductor, the wires that connect the myriad logic blocks are literally all over the memory. This is made worse by the fact ... » read more

Mobile Memory Madness
By Ed Sperling - 15 Nov, 2012 - Comments: 0

By Mark LaPedus The insatiable thirst for more bandwidth in smartphones, tablets and other devices has prompted an industry standards body to revamp its mobile memory interface roadmap. As part of the changes, the Joint Electron Devices Engineering Council (JEDEC) has scaled back the initial version of Wide I/O technology and pushed out the introduction date of a true 3D stacked architectur... » read more

Uneven Growth Ahead
By Joanne Itow - 18 Oct, 2012 - Comments: 0

By Joanne Itow SEMI recently released its silicon shipment forecast for 2012-2014. Total wafer shipments are expected to reach record levels in 2013 and 2014. Semico’s Wafer Demand model concurs with that forecast. Wafer demand is expected to grow at a compound annual rate of 11.7% over the next five years. The wafer demand pie keeps getting bigger but all the pieces are not growing at th... » read more

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