Fill Database Management Strategies At Advanced Nodes

Fill has been around for many nodes, and was originally introduced to improve manufacturing results. The foundries learned that by managing density they were able to reduce wafer thickness variations created during chemical-mechanical polishing (CMP) processes, so they introduced density design rule checks (DRC). To meet these density requirements, designers “filled” open areas of the layou... » read more

Reducing The Tapeout Crunch With Signoff Confidence

Crunch time—that last six to eight weeks before tapeout. There’s always too much to do, and too little time. No one wants problems at this stage, because problems mean changes, and changes mean delays. At leading-edge nodes, however, we’re running into some new problems that need new solutions. We all know design rule numbers and complexity are going through the roof as we try to use 1... » read more