Use of NoC IP Facilitates Tailoring SoC Platform Design into Bespoke SoC Devices

By Arteris - 27 Jun, 2024 - Comments: 0

Customer Overview Dream Chip Technologies is a German company that originated from a research think tank initiative comprised of private companies and government-funded organizations in the beginning of 1990. The results from this effort were foundational in establishing German mastery of microelectronics. Dream Chip Technologies started as a design services provider, developing intellectua... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 02 Mar, 2018 - Comments: 0

Fab tools Samsung Electronics has broken ground on a new extreme ultraviolet (EUV) lithography facility in Hwaseong, South Korea. The new EUV facility is expected to be completed within the second half of 2019 with production slated for 2020. The initial investment in the new EUV line is projected to reach $6 billion by 2020. Imec and Cadence Design Systems have collaborated on the develop... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 02 Dec, 2016 - Comments: 0

Manufacturing There are more changes at SEMI. SEMI has named David Anderson as president of the SEMI Americas region. Most recently, Anderson was chief executive and chairman of Novati, a specialty manufacturing fab. He replaces Karen Savala, who was president of the SEMI Americas region for six years. In an e-mail, Savala confirmed she left SEMI in October. Meanwhile, in October, SEMI an... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Dream Chip

Use of NoC IP Facilitates Tailoring SoC Platform Design into Bespoke SoC Devices

The Week In Review: Manufacturing

The Week In Review: Manufacturing