Post-Quantum Computing Threatens Fundamental Transport Protocols

By Karen Heyman - 01 Aug, 2024 - Comments: 0

The Transport Level Security (TLS) protocol is one of the few rock-steady spots in the rapidly changing computing industry, but that's about to change as quantum computers threaten traditional encryption schemes. Because TLS is fundamental to network communications, including allowing Internet of Things (IoT) devices to function properly, researchers already are exploring both hardware and s... » read more

Safeguarding IoT Devices With SESIP And PSA Certified Root Of Trust IP

By Bart Stevens - 11 Mar, 2024 - Comments: 0

IoT is everywhere. By the end of 2024, it’s forecasted that there will be a staggering 207 billion IoT devices in the world, that’s 25 each for every human being on Earth. The connectivity of IoT devices brings great value for consumers and businesses alike, but with great connectivity comes greater vulnerability to a wide variety of malicious attacks from cyber criminals. IoT devices ar... » read more

Securing Short-Range Communications

By John Koon - 15 Dec, 2021 - Comments: 0

Short-range wireless communication technology is in widespread use and growing rapidly, adding conveniences for consumers while also opening the door to a whole range of cyberattacks. This technology is common across a variety of applications, from wireless key fobs to unlock a car and start the ignition, to tags used to help drivers find misplaced items such as car keys. RFID also is starti... » read more

Secure Networking Basics: MACsec, IPsec, And SSL/TLS/DTLS

By Rambus - 12 Aug, 2020 - Comments: 0

The MACsec, IPsec and SSL/TLS/DTLS protocols are the primary means of securing data in motion (communicated between connected devices). These protocols can be anchored in hardware or implemented in software as part of an end-to-end security architecture. This white paper provides fundamental information on each of these protocols including their interrelationships and use cases. ... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: DTLS

Post-Quantum Computing Threatens Fundamental Transport Protocols

Safeguarding IoT Devices With SESIP And PSA Certified Root Of Trust IP

Securing Short-Range Communications

Secure Networking Basics: MACsec, IPsec, And SSL/TLS/DTLS

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon

Knowledge Centers
Entities, people and technologies explored