tag: EDA

Re-architecting Hardware For Energy
By Brian Bailey - 15 Feb, 2024 - Comments: 0

A lot of effort has gone into the power optimization of a system based on the RTL created, but that represents a small fraction of the possible power and energy that could be saved. The industry's desire to move to denser systems is being constrained by heat, so there is an increasing focus on re-architecting systems to reduce the energy consumed per useful function performed. Making signifi... » read more

Preparing For An AI-Driven Future In Chips
By Ed Sperling - 01 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of AI on semiconductor architectures, tools, and security, with Michael Kurniawan, business strategy manager at Accenture; Kaushal Vora, senior director and head of business acceleration and ecosystem at Renesas Electronics; Paul Karazuba, vice president of marketing at Expedera; and Chowdary Yanamadala, technology s... » read more

EDA Back On Investors’ Radar
By Brian Bailey - 25 Jan, 2024 - Comments: 0

EDA is transforming from a staid but strategic sector into a hot investment market, fueled by strong earnings and growth, a clamoring for leading-edge and increasingly customized designs across new and existing markets, and the rollout of advanced technologies such as AI for a range of tools that will be needed to develop new architectures with much greater performance per watt. A confluence... » read more

Respect? Confused
By Brian Bailey - 25 Jan, 2024 - Comments: 0

In a recent story, I talked about how EDA has gained respect in the financial markets, which is something it has failed to do for decades. EDA, in the eyes of Wall Street, had become a plodder through good times and bad, failing to achieve the growth shown by semiconductor companies or foundries, or the rapid rise to glory of other software companies. Of course, it never experienced the same de... » read more

Fan-Out Panel-Level Packaging Hurdles
By Anne Meixner - 24 Jan, 2024 - Comments: 0

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution layers (RDLs) formation can be scaled up with equivalent yield. There is still much work to be done before that happens. Until now, FOPLP has been adopted for devices that are manufactured in ve... » read more

Many More Hurdles In Heterogeneous Integration
By Laura Peters - 18 Jan, 2024 - Comments: 0

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where many new and familiar problems need to be addressed. The industry’s first foray into fine-pitch multi-die packaging utilized silicon interposers with through-silicon vias (TSVs) to deliver s... » read more

How Is The Chip Industry Really Doing?
By Ed Sperling - 17 Jan, 2024 - Comments: 2

Throughout 2023, the general consensus among chip industry watchers was that IC sales were flat to down, fueled by market saturation for smart phones and PCs and excess inventory and capacity in DRAM and flash. But that doesn't tell the whole story, which is becoming highly nuanced and complicated. Unlike in the past, understanding how the chip industry is faring is no longer a simple math f... » read more

Chip Industry Silos Are Crimping Advances
By Brian Bailey - 11 Jan, 2024 - Comments: 0

Change is never easy, but it is more difficult when it involves organizational restructuring. The pace of such restructuring has been increasing over the past decade, and often it is more difficult to incorporate than technological advancements. This is due to the siloed nature of the semiconductor industry, both within the industry itself, and its relationship to surrounding industries. Inc... » read more

The Evolution Of Generative AI Up To The Model-Driven Era
By Steve Brown - 07 Dec, 2023 - Comments: 0

Generative AI has become a buzzword in 2023 with the explosive proliferation of ChatGPT and large language models (LLMs). This brought about a debate about which is trained on the largest number of parameters. It also expanded awareness of the broader training of models for specific applications. Therefore, it is unsurprising that an association has developed between the term “Generative AI�... » read more

The Good Old Days Of EDA
By Brian Bailey - 30 Nov, 2023 - Comments: 5

Nostalgia is wonderful, but there is something about being involved in the formative years of an industry. Few people ever get to experience it, and it was probably one of the most fortuitous events to have happened in my life. Back in the early '80s, little in the way of design automation existed. There were a few gate- and transistor-level simulators, primarily for test and a few 'calculators... » read more

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