The Road To 5nm

By Ed Sperling - 23 Jun, 2016 - Comments: 1

There is strong likelihood that enough companies will move to 7nm to warrant the investment. How many will move forward to 5nm is far less certain. Part of the reason for this uncertainty is big-company consolidation. There are simply fewer customers left who can afford to build chips at the most advanced nodes. Intel bought Altera. Avago bought Broadcom. NXP bought Freescale. GlobalFoundrie... » read more

Spec-Driven Design

By Ed Sperling - 10 Jun, 2016 - Comments: 0

Anupam Bakshi, CEO of Agnisys, sat down with Semiconductor Engineering to discuss problems in the design flow and what needs to be fixed. What follows are excerpts of that conversation. SE: What are the big problems facing the industry? Bakshi: There is a disconnect from the specification down to the implementation. That's why verification has become so big. Specification down to implemen... » read more

DAC Day One: EDA Through Different Glasses

By Brian Bailey - 06 Jun, 2016 - Comments: 1

DAC is back in Austin after being away for three years. The weather improved for our arrival after the bad thunderstorms of the past couple of weeks. The sun came out and started to heat everything up. With water still pooling around the place, it was somewhat humorous to see a bus pass with the slogan "Think about Austin without water." DAC starts, as it always has in my memory, with a pres... » read more

Cooperation Instead Of Competition

By Bill Neifert - 03 Jun, 2016 - Comments: 0

I spent more than 20 years working in EDA and managed to do so without ever working for one of the big three. Big EDA companies were always the competition. Oh sure, you’d partner with them strategically if you could, but always keeping in mind that little fish swimming with big fish often end up being eaten. That all changed seven months ago when ARM acquired Carbon’s technology and tea... » read more

Pivot Is The New Watchword For Design Automation

By Lucio Lanza - 03 Jun, 2016 - Comments: 0

Design Automation has been a crucial part of the semiconductor industry for more than 30 years. Without it, keeping up with Moore’s Law would have been impossible. The Design Automation industry accepted the high-risk responsibility for developing the sophisticated software and algorithms at the pace necessary to corral Moore’s Law. In a sense, Design Automation had its own Moore’s la... » read more

IoT Designs Evolving

By Ed Sperling - 02 Jun, 2016 - Comments: 0

IoT hardware is beginning to take shape across a variety of vertical markets, and devices are looking far different from the initial concepts. They're smarter, more targeted, and in most cases custom-built for specific applications. The concept of connected things is hardly a new one. Students at Carnegie Mellon University added sensors into a vending machine in the early 1980s to remotely m... » read more

Preparations for DAC

By Brian Bailey - 27 May, 2016 - Comments: 1

The 53rd DAC is just days away now and the program is pretty well established at this point. It is returning to Austin after a couple of years in San Francisco. In 2013 it was held in this location for the first time and there was a herculean effort to bring the local design community to the event. They did amazing well and while attendance fell slightly compared to the previous year in San Die... » read more

Do Single-Vendor Flows Make Sense Yet?

By Ann Mutschler - 26 May, 2016 - Comments: 0

For many years in the EDA industry, there has been talk of a complete design tool flow from a single vendor, and each of the main EDA players is capable of offering one. But whether they actually do — or should — is an interesting discussion. There are obvious pros and cons on the technical side. But it is the business and marketing issues that are really at the crux of the debate today.... » read more

Bulk CMOS Vs. FD-SOI

By Mark LaPedus - 19 May, 2016 - Comments: 2

The leading edge of the chip market increasingly is divided over whether to move to finFETs or whether to stay at 28nm using different materials and potentially even advanced packaging. Decisions about which approach to take frequently boil down to performance, power, form factor, cost, and the maturity of the individual technologies. All of those can vary by market, by vendor and by process... » read more

Bridging the IP Divide

By Brian Bailey - 18 May, 2016 - Comments: 1

IP reuse enabled greater efficiency in the creation of large, complex SoCs, but even after 20 years there are few tools to bridge the divide between the IP provider and the IP user. The problem is that there is an implicit fuzzy contract describing how the IP should be used, what capabilities it provides, and the extent of the verification that has been performed. IP vendors have been trying to... » read more

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Knowledge Centers
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