tag: edge

More Data, More Processing, More Chips
By Ed Sperling - 07 Oct, 2019 - Comments: 0

Simon Segars, CEO of Arm, sat down with Semiconductor Engineering to talk about the impact of heterogeneous computing and new packaging approaches on IP, the need for more security, and how 5G and the edge will impact compute architectures and the chip industry. SE: There are a whole bunch of new markets opening up. How does Arm plan to tackle those? Segars: Luckily for us, we can design ... » read more

Memory Subsystems In Edge Inferencing Chips
By Ed Sperling - 23 Sep, 2019 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks about key issues in a memory subsystem in an inferencing chip, how factors like heat can affect performance, and where these kinds of chips will be used. » read more

VC Perspectives On An AI Summer
By Michael Stewart - 19 Sep, 2019 - Comments: 0

It’s been a busy summer for Applied Ventures. Our team has had many interactions in the startup and investing space, and added some new companies to our portfolio. I’ll be sharing highlights of these activities in a series of upcoming blogs, but first I’d like to reflect on current market developments in machine learning and how they are affecting VC investment patterns. Strategic inve... » read more

Getting Granular On The Edge
By Ed Sperling - 05 Sep, 2019 - Comments: 0

Imagine a plane flying at 30,000 feet. Two things are visible—clouds and land. In the processing world, that land mass is the edge, and as the plane begins to descend the edge begins to take on a more distinct shape and different features begin to appear. From the air, everyone can see just how large this market opportunity is. What they can't make out are the winning models for success. B... » read more

Chiplets, Faster Interconnects, More Efficiency
By Ed Sperling - 22 Aug, 2019 - Comments: 1

Big chipmakers are turning to architectural improvements such as chiplets, faster throughput both on-chip and off-chip, and concentrating more work per operation or cycle, in order to ramp up processing speeds and efficiency. Taken as a whole, this represents a significant shift in direction for the major chip companies. All of them are wrestling with massive increases in processing demands ... » read more

More Semiconductor Data Moving To Cloud
By Ed Sperling - 06 Aug, 2019 - Comments: 0

The cloud is booming. After years of steady growth it has begun to spike, creating new options for design, test, analytics and AI, all of which have an impact on every segment of the semiconductor industry. The initial idea behind the cloud is that it would supplement processing done on premises, adding extra processing power wherever necessary, such as in the verification and debug stages o... » read more

Big Shifts In Big Data
By Ed Sperling - 09 Jul, 2019 - Comments: 0

The big data market is in a state of upheaval as companies begin shifting their data strategies from "nothing" or "everything" in the cloud to a strategic mix, squeezing out middle-market players and changing what gets shared, how that data is used, and how best to secure it. This has broad implications for the whole semiconductor supply chain, because in many cases it paves the way for ... » read more

Edge Complexity To Grow For 5G
By Kevin Fogarty and Ed Sperling - 02 Jul, 2019 - Comments: 0

Edge computing is becoming as critical to the success of 5G as millimeter-wave technology will be to the success of the edge. In fact, it increasingly looks as if neither will succeed without the other. 5G networks won’t be able to meet 3GPP’s 4-millisecond-latency rule without some layer to deliver the data, run the applications and broker the complexities of multi-tier Internet apps ac... » read more

Power, Reliability And Security In Packaging
By Ed Sperling - 19 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; and Tien Shiah, senior manager for memory at Samsun... » read more

Memory Options And Tradeoffs
By Ed Sperling - 13 Jun, 2019 - Comments: 0

Steven Woo, Rambus fellow and distinguished inventor, talks with Semiconductor Engineering about different memory options, why some are better than others for certain tasks, and what the tradeoffs are between the different memory types and architectures.     Related Articles/Videos Memory Tradeoffs Intensify In AI, Automotive Applications Why choosing memories and archi... » read more

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