Chip Industry Week in Review


Check out the Inside Chips podcast for our behind-the-scenes analysis. Newly proposed U.S. legislation called the Chip Security Act would use location verification tracking as a tool to help combat chip smuggling. This follows a report by the Economist that showed Taiwan exports of advanced chips to Malaysia in the first quarter has nearly reached 2024 totals, heightening concerns that China... » read more

Chip Industry Technical Paper Roundup: Apr. 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=416 /] Find more semiconductor research papers here. » read more

Fully Digital Adaptive PMU-MCU System For Hybrid (Battery-Harvester) IoT Devices


A new technical paper titled "An Ultra-Low-Leakage Microcontroller with Configurable Power Management for Energy Harvesting IoT Devices" was published by researchers at Eindhoven University of Technology and Innatera Nanosystems. Abstract "This paper presents a power management unit (PMU) architecture designed for energy-harvesting IoT devices, integrating a dual-capacitor system, an ultra-... » read more

HW Implementation Of An ONN Coupled By A ReRAM Crossbar Array (IBM, TU Eindhoven)


A new technical paper titled "Hardware Implementation of Ring Oscillator Networks Coupled by BEOL Integrated ReRAM for Associative Memory Tasks" was published by researchers at IBM Research Europe and Eindhoven University of Technology. Abstract "We demonstrate the first hardware implementation of an oscillatory neural network (ONN) utilizing resistive memory (ReRAM) for coupling elements. ... » read more

Chip Industry Week In Review


Semiconductor industry energy consumption grew 125% between 2015 and 2023, while direct greenhouse gas emissions rose 23% in the same period, according to the Europe think tank Interface, which analyzed corporate social responsibility reports from 28 global chip manufacturers. CSIS' new report "Understanding U.S. Allies’ Current Legal Authority to Implement AI and Semiconductor Export Cont... » read more

Universities Augment Engineering Curricula To Boost Employability


Increasing numbers of universities are offering semiconductor courses in their engineering programs, and also in math, physics, and business degrees. Most universities now offer a broad foundation so students can pivot to other industries during cyclical downturns, or when technology and science create entirely new and potentially lucrative opportunities, such as generative AI, advanced pack... » read more

Chip Industry Week In Review


SK hynix started mass production of 1-terabit  321-high NAND, with availability scheduled for the first half of next year. Rapidus will receive an additional ¥200 billion yen ($1.28B) from the Japanese government beginning in fiscal year 2025, reports Nikkei. This is on top of ¥920 billion yen ($5.98B) Rapidus has already received from the government in support of its goal to reach commer... » read more

Chip Industry Technical Paper Roundup: July 22


New technical papers recently added to Semiconductor Engineering’s library. [table id=245 /] More ReadingTechnical Paper Library home » read more

In Situ Backpropagation Strategy That Progressively Updates Neural Network Layers Directly in HW (TU Eindhoven)


A new technical paper titled "Hardware implementation of backpropagation using progressive gradient descent for in situ training of multilayer neural networks" was published by researchers at Eindhoven University of Technology. Abstract "Neural network training can be slow and energy-expensive due to the frequent transfer of weight data between digital memory and processing units. Neuromorp... » read more

Chip Industry Week In Review


SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

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