tag: Eindhoven University of Technology

Chip Industry Week In Review
By The SE Staff - 22 Nov, 2024 - Comments: 0

SK hynix started mass production of 1-terabit  321-high NAND, with availability scheduled for the first half of next year. Rapidus will receive an additional ¥200 billion yen ($1.28B) from the Japanese government beginning in fiscal year 2025, reports Nikkei. This is on top of ¥920 billion yen ($5.98B) Rapidus has already received from the government in support of its goal to reach commer... » read more

Chip Industry Technical Paper Roundup: July 22
By Linda Christensen - 22 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=245 /] More ReadingTechnical Paper Library home » read more

In Situ Backpropagation Strategy That Progressively Updates Neural Network Layers Directly in HW (TU Eindhoven)
By Technical Paper Link - 16 Jul, 2024 - Comments: 0

A new technical paper titled "Hardware implementation of backpropagation using progressive gradient descent for in situ training of multilayer neural networks" was published by researchers at Eindhoven University of Technology. Abstract "Neural network training can be slow and energy-expensive due to the frequent transfer of weight data between digital memory and processing units. Neuromorp... » read more

Chip Industry Week In Review
By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Chip Industry Week In Review
By The SE Staff - 08 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan AMD took the covers off new AI accelerators for training and inferencing of large language model and high-performance computing workloads. In its announcement, AMD focused heavily on performance leadership in the commercial AI processor space through a combination of architectural changes, better software efficiency, along with some improvements in... » read more

Research Bits: November 14
By Jesse Allen - 14 Nov, 2023 - Comments: 0

Solid-state thermal transistor for heat management Researchers from University of California Los Angeles created a stable and fully solid-state thermal transistor that uses an electric field to control a semiconductor device’s heat movement. It is compatible with integrated circuits in semiconductor manufacturing processes. The team’s design incorporates the field effect on charge dynamics... » read more

Chip Industry Talent Shortage Drives Academic Partnerships
By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Blog Review: September 6
By Jesse Allen - 06 Sep, 2023 - Comments: 0

Cadence's Reela Samuel listens in as industry experts discuss whether generative AI-powered tools could facilitate the creation of diverse chip types and address talent shortages by creating  a more accessible entry point for those interested in circuit, chip, or system design. Synopsys' Ian Land, Jigesh Patel, and Kenneth Larsen find that the way that today’s government, aerospace, and d... » read more

Chip Industry’s Technical Paper Roundup: July 24
By Liz Allan - 24 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=119 /] More Reading Technical Paper Library home » read more

How To Fine-Tune Large-Area Molybdenum Disulfide Atomic Layer Deposition At 150°C
By Technical Paper Link - 19 Jul, 2023 - Comments: 0

A technical paper titled "Toolbox of Advanced Atomic Layer Deposition Processes for Tailoring Large-Area MoS2 Thin Films at 150 °C" was published by researchers at Eindhoven University of Technology, University of Michigan, and University College Cork. Abstract: "Two-dimensional MoS2 is a promising material for applications, including electronics and electrocatalysis. However, scalable meth... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy