Manufacturing Bits: Jan. 17

By Mark LaPedus - 17 Jan, 2017 - Comments: 0

GOOI FETs The next-generation power semiconductor market is heating up. Two wide-bandgap technologies—gallium nitride (GaN) on silicon devices and silicon carbide (SiC) MOSFETs—are ramping up in the power semi market. In addition, the industry is also exploring various futuristic technologies, such as bulk vertical GaN, diamond FETs and others. Purdue University has demonstrated another... » read more

Manufacturing Bits: March 15

By Mark LaPedus - 15 Mar, 2016 - Comments: 0

More multi-beam The multi-beam e-beam market is a hot topic. For example, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications. Meanwhile, at the recent SPIE Advanced Lithography conference, Mapper Lithography disclosed new upgrades for its multi-beam e-beam tool for use in direct-write lithography application... » read more

Manufacturing Bits: Aug. 27

By Mark LaPedus - 27 Aug, 2013 - Comments: 0

Growing tubes Single-wall carbon nanotubes could one day be used in electronics, optoelectronics, biomedical imaging and other applications. But the synthesis of nanotubes with defined chiralities has been a stumbling block. A chiral molecule is a molecule that has a non-superposable mirror image. The University of Southern California has shown that chirality-pure short nanotubes can be use... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Empa

Manufacturing Bits: Jan. 17

Manufacturing Bits: March 15

Manufacturing Bits: Aug. 27