Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 09 Dec, 2022 - Comments: 0

Pervasive computing Swedish-based Ericsson is selling its IoT business platform to Aeris for an undisclosed amount. Ericsson will transfer its IoT Accelerator and Connected Vehicle Cloud businesses and assets to Aeris, a company that focuses on industrial, automotive, and medical IoT networks. The complexity and fragmentation of the IoT space requires more custom and hands on maintenance. Acco... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 18 Jan, 2019 - Comments: 0

Internet of Things A dairy barn without any people working in it. An automated greenhouse for produce. Coming soon, little robots that will weed crop fields and look for diseased plants. This is Rivendale Farms, in the countryside west of Pittsburgh, which is 175 acres serving as a beta site for agricultural Internet of Things technology. The small farm has about 150 Jersey cows, each of which... » read more

Manufacturing Bits: Nov. 18

By Mark LaPedus - 18 Nov, 2014 - Comments: 0

Street light EV charging stations Looking for a place to re-charge an electric car on the road? BMW has developed one possible solution, at least in Europe. The automotive giant has demonstrated a street lighting system that doubles as a charging station for electric vehicles. Part of a pilot project called Light and Charge, the first two prototype systems have moved into operation at BMW W... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: EnBW

Week In Review: Auto, Security, Pervasive Computing

Week in Review: IoT, Security, Auto

Manufacturing Bits: Nov. 18