What Can Go Wrong In Automotive

By Ed Sperling - 17 Jan, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss automotive engineering with Jinesh Jain, supervisor for advanced architectures in Ford’s Research and Innovation Center in Palo Alto; Raed Shatara, market development for automotive infotainment at [getentity id="22331" comment="STMicroelectronics"]; Joe Hupcey, verification product technologist at [getentity id="22017" e_name="Mentor Graphics"]; ... » read more

Smart Manufacturing Gains Momentum

By Ed Sperling - 05 Jan, 2017 - Comments: 0

Smart manufacturing is gaining traction as a way of addressing increased market fragmentation while still leveraging economies of scale. The goal is to add a level of flexibility into manufacturing processes that until recently was considered impossible. Although the approach makes sense in theory, real-world implementation is proving far from consistent. Sometimes referred to as Industr... » read more

CEO Outlook: Chip Design 2017

By Ed Sperling - 22 Dec, 2016 - Comments: 0

After two consecutive flat to slightly down years, the semiconductor industry is poised for growth in 2017. Cowan this month predicted 4.7% growth in semiconductor sales in 2017, while World Semiconductor Trade Statistics (WSTS) put that figure at 3.3%. And last month, International Business Strategies (IBS) pegged the number at 4.6%, according to statistics compiled by the Global Semiconduc... » read more

All I Want For Christmas…

By Mike Gianfagna - 22 Dec, 2016 - Comments: 0

As I write this, we’re heading into the 2016 holiday season. December 21 is also the shortest day of the year, so I better get right to the point. 2016 has been a year of many surprises. The spectacular consolidation in the semiconductor industry has permanently altered the landscape. It has created new, world-class capability and left a few gaps as well. 2.5D designs are finally moving ... » read more

What’s Missing In Advanced Packaging

By Ann Mutschler - 22 Dec, 2016 - Comments: 0

Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

The Week In Review: Design

By Jesse Allen - 16 Dec, 2016 - Comments: 0

IP eSilicon launched 14nm FinFET and 28nm planar HBM Gen2 Hardened PHY. It supports up to 256Gbytes/sec bandwidth with 8x128b channels at 2Gbps per I/O, and the integrated I/O supports up to 2Gbps DDR operation across a 4mm interposer channel. The PHY was developed on Samsung 14LPP and TSMC 28HPC technologies. Flex Logix designed a high-performance embedded FPGA IP core for TSMC 16FF+ and... » read more

Timing Closure Issues Resurface

By Ed Sperling - 07 Dec, 2016 - Comments: 1

Timing closure has resurfaced as a major challenge at 10nm and 7nm due to more features and power modes, increased process variation and other manufacturing-related issues. While timing-related problems are roughly correlated to rising complexity in semiconductors, they tend to generate problems in waves—about once per decade. In SoCs, timing closure problems have spawned entire methodolog... » read more

New Wave Of Consolidation

By Ed Sperling - 22 Nov, 2016 - Comments: 0

Consolidation is picking up again across the semiconductor industry, against a backdrop of looming interest rate hikes, geopolitical uncertainty, and the erosion of longstanding demarcations between markets. In the past couple of weeks, Siemens signed a deal to buy [getentity id="22017" e_name="Mentor Graphics"] for $4 billion, and [getentity id="22865" e_name="Samsung"] purchased Harman, a ... » read more

Making 2.5D, Fan-Outs Cheaper

By Ed Sperling - 17 Nov, 2016 - Comments: 2

Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

Healthcare IoT: Promise And Peril

By Gale Morrison - 03 Nov, 2016 - Comments: 1

By Gale Morrison & Ed Sperling As more connectivity and communication capability is built into everyday healthcare and medical devices, engineers are tasked with ensuring these devices are both completely secure and ultra-reliable. Reliability generally is measured in mean time between failure (MTBF), but when it comes to safety-critical markets, that equation takes on a whole new... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: eSilicon