Manufacturing Bits: Aug. 31

By Mark LaPedus - 31 Aug, 2021 - Comments: 0

X-ray nanotomography The U.S. Department of Energy’s (DOE) Argonne National Laboratory has developed a new method for improving the resolution of hard X-ray nanotomography. In general, tomography involves a system, which takes images or cross sections of a sample using X-rays or ultrasound. The images are then re-created in the form of a 3D model. One common form is called micro-comput... » read more

Manufacturing Bits: Feb. 13

By Mark LaPedus - 13 Feb, 2018 - Comments: 0

Watching nanowires grow Using X-ray techniques, the University of Siegen and the Karlsruhe Institute of Technology (KIT) have observed the formation of tiny nanowires in gallium arsenide (GaAs) materials in real time. GaAs is used for fiber optics, infrared systems, RF devices in mobile phones and solar panels in spacecraft. Observing the growth of GaAs nanowires could lead to a better unde... » read more

Manufacturing Bits: Nov. 28

By Mark LaPedus - 28 Nov, 2017 - Comments: 0

Cryogenic microscopes The European Synchrotron Radiation Facility (ESRF) has developed and commissioned a new cryo-electron microscope. A form of transmission electron microscopy (TEM), cryo-electron microscopy (cryo-EM) is used to study a sample at cryogenic temperatures. A gas is assumed to be cryogenic if it can be liquefied at or below −150 °C. Cyro-EM is often used in structural ... » read more

Manufacturing Bits: May 3

By Mark LaPedus - 03 May, 2016 - Comments: 0

DNA thermometers The University of Montreal has taken DNA and built the world’s smallest thermometer. The programmable DNA thermometer is 5nm, or 20,000 times smaller than a human hair. Applications for the technology include cell imaging, nanofluidics, nanomedicine, nanoelectronics and synthetic biology, according to the University of Montreal. Researchers added optical reporters to D... » read more

Manufacturing Bits: Sept. 22

By Mark LaPedus - 22 Sep, 2015 - Comments: 0

Superconductor puddles Superconductors are devices that have zero electrical resistance, making them attractive for a range of applications. But superconductors must be cooled down to temperatures near zero to work, which, in turn, limits their applications. High-temperature superconductors are more promising technologies, but once again, they must be cooled down to function. The industr... » read more

Manufacturing Bits: Sept. 8

By Mark LaPedus - 08 Sep, 2015 - Comments: 0

World’s pressure record The University of Bayreuth and the Deutsches Elektronen-Synchrotron (DESY) have set another world’s record for the highest static pressure ever achieved in a lab. Researchers were able to demonstrate metal osmium at pressures of up to 770 Gigapascals (GPa). Osmium is one of the world’s most incompressible metals. The 770 GPa figure is about 130 GPa higher than ... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ESRF

Manufacturing Bits: Aug. 31

Manufacturing Bits: Feb. 13

Manufacturing Bits: Nov. 28

Manufacturing Bits: May 3

Manufacturing Bits: Sept. 22

Manufacturing Bits: Sept. 8

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