Using ML For Improved Fab Scheduling

By Katherine Derbyshire - 25 Jul, 2023 - Comments: 0

Expanding fab capacity is slow and expensive even under ideal circumstances. It has been still more difficult in recent years, as pandemic-related shortages have strained equipment supply chains. When integrated circuit demand rises faster than expansions can fill the gap, fabs try to find “hidden” capacity through improved operations. They hope that more efficient workflows will allow e... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 21 Oct, 2022 - Comments: 0

Fallout from the new U.S. export controls continues. Under new regulations, companies looking to supply Chinese chipmakers with advanced manufacturing equipment (<14nm) must first obtain a license from the U.S. Department of Commerce. In addition, U.S. persons (citizens and permanent residents) are barred from supporting China’s advanced chip development or production without a license. ... » read more

Automotive IC Shortage Drags On

By Patrick Waurzyniak - 20 May, 2021 - Comments: 1

The current automotive semiconductor shortages won’t end anytime soon. When the COVID-19 pandemic hit in early 2020, it wreaked havoc on the worldwide supply chain, but it especially caught automakers flat-footed. When the auto OEMs canceled chip orders during a roughly eight-week period of plant shutdowns, they later found their supplies of critical ICs had evaporated. To make it an ev... » read more

China Passes Americas And Japan In IC Capacity

By Christian Dieseldorff - 18 Feb, 2021 - Comments: 0

Back in 2012, China ranked fifth among seven regions worldwide in IC wafer capacity but surged past the Americas and Japan in 2018 and 2019 to claim the number three position (figure 1). That’s a big deal given that ICs account for the largest share of wafer capacity excluding discrete, opto, MEMS and sensors. China’s IC wafer capacity growth accelerated to tune of 14% in 2019 and 21% in... » read more

EDA Grabs Bigger Slice Of Chip Market

By Brian Bailey - 31 Jan, 2019 - Comments: 0

EDA revenues have been a fairly constant percentage of semiconductor revenues, but that may change in 2019. With new customers creating demand, and some traditional customers shifting focus from advanced nodes, the various branches of the EDA tool industry may be where sticky technical problems are solved. IC manufacturing, packaging and development tools all are finding new ways to handle t... » read more

Watch Out For 200mm Fabs: Fab Outlook To 2020

By Christian Dieseldorff - 24 Oct, 2016 - Comments: 0

One year after the debut of the industry’s first 200mm Fab Outlook report, SEMI has just issued an October 2016 update with the improved and expanded report forecasting 200mm fab trends out to 2020. This extensive report features trends from 2009 to 2020, showing how 200mm fab activities and capacity change worldwide. Industry spending for construction and equipment is detailed and analy... » read more

Wafer Shortage? Reality Versus Perception

By Joanne Itow - 19 May, 2016 - Comments: 0

The promise of explosive growth associated with IoT has semiconductor unit forecasts growing at double-digit rates for key product categories. Anything with the word ‘sensors’ seems to be in vogue today. Sensors, image sensors, sensor hubs are all expected to benefit from the billions of connected devices that are forecasted to be in place by 2020. Semico agrees. Unit growth for key product... » read more

The Semiconductor Future Looks Bright!

By Yoichiro Ando - 22 Jan, 2015 - Comments: 0

At the beginning of the SEMI Market Forum held on Dec. 4, during the 38th SEMCON Japan, session moderator and SEMI Global Vice President Jonathan Davis said, “There are significant changes in the semiconductor industry and it is not the industry it was 38 years ago, 10 years ago, even 5 years ago. There have been dramatic changes in technology complexity in addition to incredible industry adv... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: fab capacity