How Secure Is Your Face?

By Yuri Nagano - 07 Nov, 2019 - Comments: 0

Biometric security, which spans everything from iris scans to fingerprint sensors, is undergoing the same kind of race against hackers as every other type of sensor. While most of these systems work well enough to identify a person, there are a number of well-known ways to defeat them. One is simply to apply newer technology to cracking algorithms used inside these devices. Improvements in p... » read more

Holes In AI Security

By Ed Sperling - 06 Jun, 2019 - Comments: 0

Mike Borza, principal security technologist in Synopsys’ Solutions Group, explains why security is lacking in AI, why AI is especially susceptible to Trojans, and why small changes in training data can have big impacts on many devices. » read more

VCSEL Technology Takes Off

By Kevin Fogarty and Ed Sperling - 07 Feb, 2019 - Comments: 1

By Kevin Fogarty and Ed Sperling Vertical cavity surface emitting laser (VCSEL) technology, a proven but mostly niche technology until recently, is suddenly a very hot commodity thanks to the introduction of facial recognition in phones and other mobile devices. VCELS primarily have been used as a low-cost way of tracking movement and transfering data in computer mice, laser printers and ... » read more

Always-on Face Unlock

By Arm - 31 Oct, 2018 - Comments: 0

Accurate face verification has long been considered a challenge due to the number of variables, ranging from lighting to pose and facial expression. This white paper looks at a new approach—combining classic and modern machine learning (deep learning) techniques—that achieves 98.36% accuracy, running efficiently on Arm ML-optimized platforms, and addressing key security issues such as mu... » read more

Power/Performance Bits: June 12

By Jesse Allen - 12 Jun, 2018 - Comments: 0

AI for solar materials In the search for better organic photovoltaic materials, researchers at Osaka University turned to machine learning to help identify candidates. While organic photovoltaics (OPVs) are promising on a cost basis, they do not yet have the required power conversion efficiency (PCE) necessary for commercialization. A key element in this is the semiconducting polymer layer. ... » read more

System Bits: Feb. 13

By Ann Mutschler - 13 Feb, 2018 - Comments: 0

Enabling individual manufacturing apps Researchers at the Fraunhofer Institute for Computer Graphics Research IGD focused on Industrie 4.0 recognize that manufacturing is turning toward batch sizes of one and individualized production in what is sometimes referred to as ‘highly customized mass production.’ [caption id="attachment_24131609" align="aligncenter" width="300"] The scanning ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.