tag: FDSOI

Momentum Builds For Monolithic 3D ICs
By Mark LaPedus - 14 Nov, 2013 - Comments: 1

The 2.5D/3D chip market is heating up on several fronts. On one front, stacked-die using through-silicon vias (TSVs) is taking root. In a separate area, Samsung is sampling the world’s first 3D NAND device, with Micron and SK Hynix expected to follow suit. And now, there is another technology generating steam—monolithic 3D integrated circuits. In stacked-die, bare die are connected using... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 01 Nov, 2013 - Comments: 0

Silver surfers represent a more important technology market than “Generation X” and “Generation Y,” according to research from Gartner. Silver surfers are people in middle age or approaching old age. Although most technologists fail to recognize this fact, they are very interested in using technology and also have the time and the resources to pursue their interests, according to Gartne... » read more

VLSI Kyoto – The SOI Papers
By Various Writers - 19 Jun, 2013 - Comments: 0

By Adele Hars There were some breakthrough FD-SOI and other excellent SOI-based papers that came out of the 2013 Symposia on VLSI Technology and Circuits in Kyoto (June 10-14, 2013). By way of explanation, VSLI comprises two symposia: one on Technology; one on Circuits. However, papers that are relevant to both were presented in “Jumbo Joint Focus” sessions.  The papers should all b... » read more

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