Cloud Or On-premises? Why Not Both: A Hybrid Approach For Structure Simulation


Faced with large problem sizes and urgent deadlines, it’s not surprising that more and more product development teams are accessing high-performance computing (HPC) resources on the cloud. After all, a cloud computing model enables you to access the most advanced, leading-edge software and hardware on demand. There are no queues or wait times. Users can “dial up” core counts and other set... » read more

Computational Software: The Foundation Across Software Disciplines


You may have seen the term "computational software" more often recently. What are some prominent examples? Why do we in the electronic design automation (EDA) industry have to deal with math in the first place? Wasn't chip design all about drawing polygons at one point? I’m glad you asked! Computational software supports and manages the complexity of fundamental industry trends—hyperscal... » read more

Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science


Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come challenges that can impact ... » read more