Manufacturing Bits: Nov. 28

By Mark LaPedus - 28 Nov, 2017 - Comments: 0

Cryogenic microscopes The European Synchrotron Radiation Facility (ESRF) has developed and commissioned a new cryo-electron microscope. A form of transmission electron microscopy (TEM), cryo-electron microscopy (cryo-EM) is used to study a sample at cryogenic temperatures. A gas is assumed to be cryogenic if it can be liquefied at or below −150 °C. Cyro-EM is often used in structural ... » read more

Manufacturing Bits: April 4

By Mark LaPedus - 04 Apr, 2017 - Comments: 0

Open-source tomography software The University of Michigan, Cornell University and Kitware have developed an open-source software platform that enables three-dimensional imaging of nanomaterials. The open-source platform, dubbed Tomviz 1.0, enables researchers to image and process nanomaterials using electron tomography. Researchers can download the software. Using tomography, the software... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 27 May, 2016 - Comments: 0

Fab tools Thermo Fisher Scientific and FEI have announced that their boards of directors have unanimously approved Thermo Fisher’s acquisition of FEI for $107.50 per share in cash. The transaction represents a purchase price of approximately $4.2 billion. In a video, Aki Fujimura, chief executive of D2S, recaps the emerging mask and lithography trends presented at the recent Photomask Ja... » read more

Manufacturing Bits: April 19

By Mark LaPedus - 19 Apr, 2016 - Comments: 0

Hot videos The University of Minnesota has recorded videos that show how heat travels through materials, a move that could give researchers insight into the behavior of atoms and other structures. It could also pave the way towards the development of more efficient materials for use in electronics and other applications. In the lab, researchers used FEI’s transmission electron microsc... » read more

Waiting For Next-Gen Metrology

By Mark LaPedus - 21 May, 2015 - Comments: 0

Chipmakers continue to march down the various process nodes, but the industry will require new breakthroughs to extend IC scaling at 10nm and beyond. In fact, the industry will require innovations in at least two main areas—patterning and the [getkc id="36" comment="Interconnect"]. There are other areas of concern, but one technology is quickly rising near the top of the list—metrology.... » read more

Week In Review: Manufacturing, Design, Test

By Mark LaPedus - 07 Feb, 2014 - Comments: 0

This is no surprise, but it could be the end of an era. IBM is exploring a sale of its semiconductor business, according to FT.com. A survey, conducted by Harris Interactive on behalf of Crucial.com, revealed that when asked to choose between these two specific types of men, 84% of women who prefer to be involved with men prefer their male love interest to be "super handy" with computers an... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer