Challenges In Printed And Disposable Chips


Printing inexpensive chips using technology developed for newspapers and magazines is gaining traction across a wide range of applications, from photovoltaic cells to sensors on a flexible substrate. But it's also adding a slew of new challenges that are unique to this approach. The world of flexible hybrid electronics (FHE) — printing integrated circuits on or attaching thin IC chips to a... » read more

Week In Review: Auto, Security, Pervasive Computing


AI/Edge The United States Department of Defense (DOD) has adopted ethical principles for using artificial intelligence in warfare that chiefly say the U.S. has to follow the laws, treaties, in use of AI in warfare. Any AI used by DOD has to be responsible, equitable, traceable, reliable and governable. “The Department will design and engineer AI capabilities to fulfill their intended functio... » read more

Week In Review: Auto, Security, Pervasive Computing


Internet of Things SEMI-FlexTech launched six flexible hybrid electronics (FHE) projects, collaborating with U.S. Army Research Laboratory (ARL), to accelerate innovations in sensor and sensor systems. Participating in the projects are American Semiconductor, Inc., University of Texas El Paso, Tekscan, PARC, Alertgy, and Iowa State University, among others. Some of the projects include develop... » read more

Scaling Sideways


The next steps in semiconductor technology don't follow the same vectors. While 3nm chips are likely to roll out at some point in the future, it's not clear what the business case will be for developing them. What's clear is the number of companies developing chips at that node will shrink to a handful (or less), because they're going to be far too expensive to design, verify and manufacture... » read more

New Roadmap For Electronics


Tech Talk: Melissa Grupen-Shemansky, CTO for SEMI’s FlexTech Group and Advanced Packaging program, looks at what’s changing now that Moore’s Law is slowing, and how packaging is changing as the traditional physical boundaries of electronics begin breaking down. https://youtu.be/UpH1m8Oru90 » read more

Non-Traditional Chips Gaining Steam


Flexible hybrid electronics are beginning to roll out in the form of medical devices, wearable electronics and even near-field communications tags in retail, setting the stage for a whole new wave of circuit design, manufacturing and packaging that reaches well beyond traditional chips. FHE devices begin with substrates made of ceramics, glass, plastic, polyimide, polymers, polysilicon, stai... » read more

Terrific Year, Terrific Outlook


2017 was a terrific year. Chip revenues closed at nearly $440B, an impressive 22 percent year-over-year growth. The equipment industry surpassed revenue levels last reached in the year 2000. Semiconductor equipment posted sales of nearly $56B and semiconductor materials $48B in 2017. For semiconductor equipment, this was a giant 36 percent year-over-year growth. Samsung, alone, invested $26... » read more

The Week In Review: IoT


Finance Samsara, an Industrial Internet of Things startup, raised $40 million in its Series C financing, led by General Catalyst. Andreesen Horowitz, an existing investor, and Samsara’s founders also participated in the funding round, which values the company at $530 million. The supplier of Internet-connected sensors for industrial and transportation applications has raised a total of $80 m... » read more

Successful FlexTech Integration Providing New Opportunities for SEMI Members


By Michael Ciesinski, President, FlexTech In 2014, SEMI developed a new model – SEMI Strategic Association Partnership – for engaging other associations and organizations in a strategic, long-term relationship that supports and advances the interests of SEMI members in emerging and adjacent segments of the electronics supply chain. The strategic partner brings a community, brand, and pro... » read more