Fan-Out Packaging Options Grow

By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a challenge. Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and sma... » read more

System Bits: Oct. 1

By Jeff Dorsch - 01 Oct, 2019 - Comments: 0

Jumping the gap in microchips A quasi-particle that travels along the interface of a metal and dielectric material may be the solution to problems caused by shrinking electronic components, according to an international team of engineers. "Microelectronic chips are ubiquitous today," said Akhlesh Lakhtakia, Evan Pugh University Professor and Charles Godfrey Binder Professor of Engineering S... » read more

System Bits: Dec. 10

By Brian Bailey - 10 Dec, 2013 - Comments: 0

Lasers From Nano Wires A few weeks ago, Semiconductor Engineering published a special report about silicon photonics and concentrated on the integration of the laser onto the silicon surface. Growing III-V materials on silicon is problematic because of the lattice mismatch, but researchers at the Technische Universität München (TUM) may have found a way around that problem. Thread-like semic... » read more

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tag: fiber-optic communications

Fan-Out Packaging Options Grow

System Bits: Oct. 1

System Bits: Dec. 10

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