Evaluation of the Thermomechanical Reliability of Electronic Packages Using Virtual Prototyping

A new technical paper titled "Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies" was published by Fraunhofer ENAS. Abstract "A methodology is presented that allows the evaluation of the thermomechanical reliability of electronic packages using “virtual prototyping.” He... » read more