tag: flexible electronics

An Eco-Friendly Conductive Ink For Thin-Film Electronics
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Recyclable Thin-Film Soft Electronics for Smart Packaging and E-Skins” was published by researchers at Carnegie Mellon University and University of Coimbra. Abstract: Despite advances in soft, sticker-like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco-friendly conductive ink for thin-film... » read more

FLEX 2023 Takeaways: Flexible And Printed Electronics Move Into Electronics Manufacturing
By Gity Samadi - 17 Aug, 2023 - Comments: 0

By Gity Samadi and Paul Semenza The FLEX Conference, held again this year in conjunction with SEMICON West 2023, provided numerous examples of continued developments in flexible, printed, and flexible hybrid electronics technologies applied to sensing, robotics, communications, and other applications. At the same time, there is growing focus on applying various additive manufacturing equipme... » read more

Research Bits: Aug. 7
By Jesse Allen - 07 Aug, 2023 - Comments: 0

Stretchy semiconductors Researchers from Pennsylvania State University, University of Houston, Southeast University, and Northwestern University are working towards fully flexible electronics. “Such technology requires stretchy elastic semiconductors, the core material needed to enable integrated circuits that are critical to the technology enabling our computers, phones and so much more,... » read more

Research Bits: July 24
By Jesse Allen - 24 Jul, 2023 - Comments: 0

Protons improve ferroelectric memory Researchers from King Abdullah University of Science and Technology (KAUST), Qingdao University, and Zhejiang University developed a method to produce multiple phase transitions in ferroelectric materials, which could increase storage capacity for neuromorphic memory. The approach uses proton-mediation of the ferroelectric material indium selenide. The r... » read more

Overview Of The State Of Semiconducting TMDC Research
By Technical Paper Link - 14 Jul, 2023 - Comments: 0

A technical paper titled "Potential of Transition Metal Dichalcogenide Transistors for Flexible Electronics Applications" was published by researchers at Advanced Microelectronic Center Aachen (AMICA), RWTH Aachen University, and Bergische Universität Wuppertal. Abstract: "Semiconducting transition metal dichalcogenides (TMDC) are 2D materials, combining good charge carrier mobility, ultimat... » read more

An Integrated Fabrication Approach For Fully EHD-Printed Flexible Organic Thin Film Transistors (OTFTs) 
By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled "All Electrohydrodynamic Printed Flexible Organic Thin Film Transistors" was published by researchers at North Carolina State University. Abstract: "The demand of cost-effective fabrication of printed flexible transistors has dramatically increased in recent years due to the need for flexible interface devices for various application including e-skins, wearables, and ... » read more

Smelling The Metaverse Via Wearable Wireless Interfaces
By Technical Paper Link - 09 May, 2023 - Comments: 0

A new technical paper titled "Soft, miniaturized, wireless olfactory interface for virtual reality" was published by researchers at  City University of Hong Kong, Hong Kong Science Park, Beihang University, and others. Abstract "Recent advances in virtual reality (VR) technologies accelerate the creation of a flawless 3D virtual world to provide frontier social platform for human. Equall... » read more

Split Additive Manufacturing for Printed Neuromorphic Circuits (Karlsruhe Institute of Technology)
By Technical Paper Link - 05 May, 2023 - Comments: 0

A new technical paper titled "Split Additive Manufacturing for Printed Neuromorphic Circuits" was published by researchers at Karlsruher Institut für Technologie (KIT). Abstract: "Printed and flexible electronics promises smart devices for application domains, such as smart fast moving consumer goods and medical wearables, which are generally untouchable by conventional rigid silicon tech... » read more

Research Bits: March 6
By Jesse Allen - 06 Mar, 2023 - Comments: 0

2D TMDs on silicon Engineers at MIT, University of Texas at Dallas, Institute for Basic Science, Sungkyunkwan University, Washington University in St. Louis, University of California at Riverside, ISAC Research, and Yonsei University found a way to grow 2D materials on industry-standard silicon wafers while preserving their crystalline form. Using a new “nonepitaxial, single-crystalline g... » read more

Research Bits: Jan. 24
By Jesse Allen - 24 Jan, 2023 - Comments: 0

Transistor-free compute-in-memory Researchers from the University of Pennsylvania, Sandia National Laboratories, and Brookhaven National Laboratory propose a transistor-free compute-in-memory (CIM) architecture to overcome memory bottlenecks and reduce power consumption in AI workloads. "Even when used in a compute-in-memory architecture, transistors compromise the access time of data," sai... » read more

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