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Additive Techniques For Flexible Hybrid Electronics Packaging And Integration With Human Body


By Gity Samadi and Paul Semenza Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component packages, and insertion processes used in traditional printed circuit boards. Thin, flexible substrates, bare die, and combinations of printed and small-format package... » read more

Research Bits: July 11


Modeling ALE Scientists at U.S. Department of Energy’s (DOE) Princeton Plasma Physics Laboratory (PPPL), in coordination with Lam Research, modeled atomic layer etching (ALE) for semiconductor fabrication. “This would be one little piece in the whole process,” said David Graves, associate laboratory director for low-temperature plasma surface interactions at PPPL and a professor in th... » read more

Flexible Microprocessors (FlexiCores)- Natively flexible 4-bit and 8-bit microprocessors optimized for low footprint and yield


New research paper titled "FlexiCores: low footprint, high yield, field reprogrammable flexible microprocessors" from researchers at University of Illinois and PragmatIC Semiconductor. Abstract "Flexible electronics is a promising approach to target applications whose computational needs are not met by traditional silicon-based electronics due to their conformality, thinness, or cost requir... » read more

Research Bits: May 31


Carbon nanotube transistors Researchers from the National Institute for Materials Science, National University of Science and Technology, Emanuel Institute of Biochemical Physics, Chinese Academy of Sciences, National Institute of Advanced Industrial Science and Technology, University of Tokyo, Tianjin University, and Queensland University of Technology created transistors out of carbon nanotu... » read more

Research Bits: May 24


Printed flexible OLED display Researchers from the University of Minnesota Twin Cities and Korea Institute of Industrial Technology used a customized 3D printer to print a flexible OLED display. “OLED displays are usually produced in big, expensive, ultra-clean fabrication facilities,” said Michael McAlpine, a professor in the Department of Mechanical Engineering at University of Minnes... » read more

Miniaturized Liquid Metal-based Flexible Electrochemical Detection System on Fabric


Researchers from Beihang University (Beijing), Zhejiang University, and Tsinghua University. Abstract "Integrated electrochemical sensing platforms in wearable devices have great prospects in biomedical applications. However, traditional electrochemical platforms are generally fabricated on airtight printed circuit boards, which lack sufficient flexibility, air permeability, and conformab... » read more

Die-level Thinning and Integrating Route For Singulated MPW Chips Using Both Silicon Sensors and CMOS Devices


Abstract "Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing method on two silicon devices, an el... » read more

Research Bits: April 13


Washable battery Researchers from the University of British Columbia developed a washable, flexible, and stretchable battery. “Wearable electronics are a big market and stretchable batteries are essential to their development,” said Dr. Ngoc Tan Nguyen, a postdoctoral fellow at UBC’s faculty of applied science. “However, up until now, stretchable batteries have not been washable. Th... » read more

Large-area photonic lift-off process for flexible thin-film transistors


Abstract "Fabricating flexible electronics on plastic is often limited by the poor dimensional stability of polymer substrates. To mitigate, glass carriers are used during fabrication, but removing the plastic substrate from a carrier without damaging the electronics remains challenging. Here we utilize a large-area, high-throughput photonic lift-off (PLO) process to rapidly separate polymer f... » read more

Power/Performance Bits: Jan. 3


Optical device integration Researchers from the University of Strathclyde, University of Glasgow, and the Australian National University propose a way to place multiple micron-scale optical devices made from different materials close together on a single silicon chip. “The development of electronics that are based on silicon transistors has enabled increasingly more powerful and flexible ... » read more

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