tag: flexible electronics

Split Additive Manufacturing for Printed Neuromorphic Circuits (Karlsruhe Institute of Technology)
By Technical Paper Link - 05 May, 2023 - Comments: 0

A new technical paper titled "Split Additive Manufacturing for Printed Neuromorphic Circuits" was published by researchers at Karlsruher Institut für Technologie (KIT). Abstract: "Printed and flexible electronics promises smart devices for application domains, such as smart fast moving consumer goods and medical wearables, which are generally untouchable by conventional rigid silicon tech... » read more

Research Bits: March 6
By Jesse Allen - 06 Mar, 2023 - Comments: 0

2D TMDs on silicon Engineers at MIT, University of Texas at Dallas, Institute for Basic Science, Sungkyunkwan University, Washington University in St. Louis, University of California at Riverside, ISAC Research, and Yonsei University found a way to grow 2D materials on industry-standard silicon wafers while preserving their crystalline form. Using a new “nonepitaxial, single-crystalline g... » read more

Research Bits: Jan. 24
By Jesse Allen - 24 Jan, 2023 - Comments: 0

Transistor-free compute-in-memory Researchers from the University of Pennsylvania, Sandia National Laboratories, and Brookhaven National Laboratory propose a transistor-free compute-in-memory (CIM) architecture to overcome memory bottlenecks and reduce power consumption in AI workloads. "Even when used in a compute-in-memory architecture, transistors compromise the access time of data," sai... » read more

Technique For Printing Electronic Circuits Onto Curved & Corrugated Surfaces Using Metal Nanowires (NC State)
By Technical Paper Link - 10 Jan, 2023 - Comments: 0

A technical paper titled "Curvilinear soft electronics by micromolding of metal nanowires in capillaries" was published by researchers at North Carolina State University. “We’ve developed a technique that doesn’t require binding agents and that allows us to print on a variety of curvilinear surfaces,” says Yuxuan Liu, first author of the paper and a Ph.D. student at NC State in this ... » read more

Research Bits: Jan. 9
By Jesse Allen - 09 Jan, 2023 - Comments: 0

Making stretchy semiconductors Researchers from Pennsylvania State University, University of Houston, Purdue University, and Texas Heart Institute developed a new method to make soft, stretchable transistors easier and cheaper to manufacture. The lateral phase separation induced micromesh (LPSM) process involves mixing a semiconductor and an elastomer and spin coating the liquid mixture pre... » read more

New Technique For Making Thin Films of Perovskite Oxide Semiconductors
By Technical Paper Link - 06 Jan, 2023 - Comments: 0

A technical paper titled "Freestanding epitaxial SrTiO3  nanomembranes via remote epitaxy using hybrid molecular beam epitaxy" was published by researchers at University of Minnesota Twin Cities, Pacific Northwest National Laboratory, and University of Wisconsin–Madison. The researchers developed a new technique for making thin films of perovskite oxide semiconductors.  The development c... » read more

Rubbery Schottky Diodes Based on Soft, Stretchy Electronic Materials (Penn State)
By Technical Paper Link - 06 Dec, 2022 - Comments: 0

A new technical paper titled "Fully rubbery Schottky diode and integrated devices" was published by researchers at Penn State University. The Office of Naval Research and the National Science Foundation funded this research. "Here, we report a fully rubbery Schottky diode constructed all based on stretchable electronic materials, including a liquid metal cathode, a rubbery semiconductor, and... » read more

Additive Techniques For Flexible Hybrid Electronics Packaging And Integration With Human Body
By Gity Samadi - 20 Oct, 2022 - Comments: 0

By Gity Samadi and Paul Semenza Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component packages, and insertion processes used in traditional printed circuit boards. Thin, flexible substrates, bare die, and combinations of printed and small-format package... » read more

Research Bits: July 11
By Jesse Allen - 11 Jul, 2022 - Comments: 0

Modeling ALE Scientists at U.S. Department of Energy’s (DOE) Princeton Plasma Physics Laboratory (PPPL), in coordination with Lam Research, modeled atomic layer etching (ALE) for semiconductor fabrication. “This would be one little piece in the whole process,” said David Graves, associate laboratory director for low-temperature plasma surface interactions at PPPL and a professor in th... » read more

Flexible Microprocessors (FlexiCores)- Natively flexible 4-bit and 8-bit microprocessors optimized for low footprint and yield
By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New research paper titled "FlexiCores: low footprint, high yield, field reprogrammable flexible microprocessors" from researchers at University of Illinois and PragmatIC Semiconductor. Abstract "Flexible electronics is a promising approach to target applications whose computational needs are not met by traditional silicon-based electronics due to their conformality, thinness, or cost requir... » read more

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