Improving PPA With AI


AI/ML/DL is starting to show up in EDA tools for a variety of steps in the semiconductor design flow, many of them aimed at improving performance, reducing power, and speeding time to market by catching errors that humans might overlook. It's unlikely that complex SoCs, or heterogeneous integration in advanced packages, ever will be perfect at first silicon. Still, the number of common error... » read more

Circuit-Device Co-design for High Performance Mixed-Signal Technologies


System-on-Chip designs require low cost integration of analog and digital blocks. Often, the analog requirements are not considered sufficiently early in the device design cycle, resulting in devices that are suboptimal for the analog components. This paper presents an innovative methodology for deriving comprehensive device specifications based upon a set of Figure-ofMerit circuits which accou... » read more

New Approaches To Low Power Design


While Moore's Law continues to drive feature size reduction and complexity, a whole separate part of the industry is growing up around vertical markets in the IoT. While these two worlds may be different in many respects, they share one thing in common—low power design is critical to success. How engineering teams minimize power in each of these markets, and even within the same market, ca... » read more

Manufacturing Bits: Dec. 3


Animal robots invade London The London Science Museum will premiere U-CAT, an underwater robot turtle designed to penetrate shipwrecks. In the exhibit, the museum will also showcase several robots that resemble an eel, bat, cheetah cub, tumbleweed, tuna, salamander and other creatures. Meanwhile, built by the Centre for Biorobotics at Tallinn University of Technology, U-CAT’s locomotio... » read more