Era Of 3D Printing Begins

By Ed Sperling - 05 Jan, 2017 - Comments: 0

3D printing has always been an interesting side technology. It's now about to become a mainstream technology. Until recently, the majority of applications for this technology have been limited for several reasons. First, there simply isn't enough history to bet the bank on commercial manufacturing using 3D printers. The initial patent for fused deposition modeling was issued in 1986, but ... » read more

What Can Go Wrong In Automotive

By Ed Sperling - 06 Oct, 2016 - Comments: 1

Semiconductor Engineering sat down to discuss automotive engineering with Jinesh Jain, supervisor for advanced architectures in Ford’s Research and Innovation Center in Palo Alto; Raed Shatara, market development for automotive infotainment at [getentity id="22331" comment="STMicroelectronics"]; Joe Hupcey, verification product technologist at [getentity id="22017" e_name="Mentor Graphics"]; ... » read more

System Bits: Jan. 12

By Ann Mutschler - 12 Jan, 2016 - Comments: 0

Coaxing human stem cells to form human organs In a step toward personalized drug testing, MIT researchers have coaxed human stem cells to form complex tissues in a new technique, which also has near-term implications for growing organ-like tissues on a chip and that may ultimately allow personalized organs to be grown for transplant patients. The researchers said growing organs on demand, u... » read more

Custom Versus Platform Design

By Ed Sperling - 26 Feb, 2015 - Comments: 0

The increase in [getkc id="81" kc_name="SoC"] complexity is being mirrored by a rise in complexity within the markets that drive demand for those chips. The upshot is that a push toward greater connectivity, lower power and better performance—and all for a minimal cost—has turned the pros and cons for custom design vs. platforms and superchips into a murky decision-making process. For t... » read more

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Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Ford Motor Co.

Era Of 3D Printing Begins

What Can Go Wrong In Automotive

System Bits: Jan. 12

Custom Versus Platform Design

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