For SDVs, Software Is The Biggest Challenge

By John Koon - 02 Nov, 2023 - Comments: 0

Software-defined vehicles (SDVs) involve far more than just OTA applications enabling software upgrades over the air. Software that will manage hundreds of ECUs and other functions within the vehicle is expected to grow beyond hundreds of millions of lines of code, possibly making SDV software development the number one challenge in automotive design. The benefits of SDVs, such as easy updat... » read more

Cybersecurity Risks Of Automotive OTA

By John Koon - 01 Dec, 2022 - Comments: 0

Modern vehicles increasingly resemble supercomputers on wheels, with many electronic control units (ECUs) networked together as increasingly sophisticated software is installed and updated. Similar to smartphones, vehicle OEMs will contact vehicle owners remotely about operating system updates that add new features and/or fixes, as well as software bugs and vulnerabilities. But all of this h... » read more

Grappling With Auto Security

By Ann Mutschler - 07 Jul, 2016 - Comments: 1

It’s a changed world under the hood of automobiles today, as vehicles become increasingly connected to infrastructure and each other. But that connectedness also is creating new security risks. Growing complexity is one piece of the problem. There are upwards of 80 electronic control units (ECUs) and more than 100 million lines of code in an average vehicle. On top of that, there are m... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: FOTA

For SDVs, Software Is The Biggest Challenge

Cybersecurity Risks Of Automotive OTA

Grappling With Auto Security