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Automated Traceability Of Requirements In The Design And Verification Process Of Safety-Critical Mixed-Signal Systems


System-level design and verification of safety-critical hardware requires a consistent methodology which complies with industrial safety-standards, for example ISO 26262 for automotive applications. For certification of safety-critical systems, the development process has to implement and enforce a strict traceability of requirements, linking the requirement specification, the design implementa... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Infineon announced it has a Trusted Platform Module (TPM 2.0), called OPTIGA TPM 2.0, used to secure remote software updates, disc encryption, and user authentication on Linux-based systems. OPTIGA is an open software stack for securing comprehensive TSS* host software implementing the latest FAPI standard. Infineon developed the open-source software with Intel Corporation and Fraunho... » read more

Power Models For Machine Learning


AI and machine learning are being designed into just about everything, but the chip industry lacks sufficient tools to gauge how much power and energy an algorithm is using when it runs on a particular hardware platform. The missing information is a serious limiter for energy-sensitive devices. As the old maxim goes, you can't optimize what you can't measure. Today, the focus is on functiona... » read more

Brute-Force Analysis Not Keeping Up With IC Complexity


Much of the current design and verification flow was built on brute force analysis, a simple and direct approach. But that approach rarely scales, and as designs become larger and the number of interdependencies increases, ensuring the design always operates within spec is becoming a monumental task. Unless design teams want to keep adding increasing amounts of margin, they have to locate th... » read more

Confusion Grows Over Packaging And Scaling


The push toward both multi-chip packaging and continued scaling of digital logic is creating confusion about how to classify designs, what design tools work best, and how to best improve productivity and meet design objectives. While the goals of design teams remains the same — better performance, lower power, lower cost — the choices often involve tradeoffs between design budgets and ho... » read more

13-Gb/s Transmitter For Bunch Of Wires Chip-To-Chip Interface Standard


Continuous downscaling of integrated circuits has reached a bottleneck. Technologies such as system in a package, multi-chip module and integration of chips on an active or passive interposer can further improve the system performance. Bunch of wires interface standard was recently introduced for chip to chip short interfaces within a package. This standard required both terminated and untermin... » read more

A 10.5 μW Programmable SAR ADC Frontend With SC Preamplifier For Low-Power IoT Sensor Nodes


Massive deployment of wireless autonomous sensor nodes requires their lifetime extension and cost reduction. The analog frontend (AFE) plays a key role in this context. This paper presents a successive approximation register analog-to-digital converter (SAR ADC) with a switched-capacitor programmable gain switched preamplifier (SC PGSA), as a basic component of an integrated ultra-low power AFE... » read more

Maximizing Value Post-Moore’s Law


When Moore's Law was in full swing, almost every market segment considered moving to the next available node as a primary way to maximize value. But today, each major market segment is looking at different strategies that are more closely aligned with its individual needs. This diversity will end up causing both pain and opportunities in the supply chain. Chip developers must do more with a ... » read more

Advanced Packaging Makes Testing More Complex


The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are co-packaged using 2.5D and 3D approaches. But this also raises complex test challenges, which are driving new standards and approaches to advanced-package testing. While many of the showstopper issues... » read more

Failure Analysis Becoming Critical To Reliability


Failure analysis is rapidly becoming a complex, costly and increasingly time-consuming must-do task as demand rises for reliability across a growing range of devices used in markets ranging from automotive to 5G. From the beginning, failure analysis has been about finding out what went wrong in semiconductor design and manufacturing. Different approaches, tools and equipment have improved ov... » read more

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