tag: Fraunhofer IAF

Research Bits: Aug. 27
By Jesse Allen - 27 Aug, 2024 - Comments: 0

Ammonia-free GaN Researchers from Nagoya University discovered a way to grow gallium nitride (GaN) semiconductors without using ammonia. The process is both more environmentally friendly and allows for high-quality growth of crystals at a lower cost. Metal organic chemical vapor deposition (MOCVD) is the most common technique for GaN production, which uses ammonia (NH3) gas as the source of... » read more

Chip Industry Talent Shortage Drives Academic Partnerships
By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Mar, 2022 - Comments: 0

Intellectual Property Flex Logix inked an agreement with the Air Force Research Laboratory, Sensors Directorate (AFRL/RY) covering any Flex Logix IP technology for use in all US Government-funded programs for research and prototyping purposes with no license fees. “Our first license with AFRL for EFLX eFPGA in GlobalFoundries 12nm process was highly successful, with more than a half dozen pr... » read more

Power Amp Wars Begin For 5G
By Mark LaPedus - 24 Aug, 2020 - Comments: 2

Demand is increasing for power amplifier chips and other RF devices for 5G base stations, setting the stage for a showdown among different companies and technologies. The power amplifier device is a key component that boosts the RF power signals in base stations. It's based on two competitive technologies, silicon-based LDMOS or RF gallium nitride (GaN). GaN, a III-V technology, outperforms ... » read more

System Bits: Jan. 16
By Ann Mutschler - 16 Jan, 2018 - Comments: 0

Nitrogen-atom-sized sensors A new quantum sensor developed by Fraunhofer researchers will be able to measure the tiny magnetic fields of the next generation of hard discs, leveraging the new opportunities that quantum technology promises. [caption id="attachment_430671" align="aligncenter" width="300"] The special ellipsoid form of the plasma reactor developed at Fraunhofer IAF allows for l... » read more

Manufacturing Bits: Sept. 12
By Mark LaPedus - 12 Sep, 2017 - Comments: 0

Failure analysis for 2.5D/3D chips Imec has developed a new failure analysis method to localize interconnection failures in 2.5D/3D stack die with through-silicon vias (TSVs). This technique is called LICA, which stands for light-induced capacitance alteration. It addresses the reliability issues for 2.5D/3D devices in a non-destructive and cost-effective manner at the wafer level. For s... » read more

Manufacturing Bits: March 8
By Mark LaPedus - 08 Mar, 2016 - Comments: 1

5G mmWave consortium Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. Carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Radio-frequency (RF... » read more

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