tag: Fraunhofer IIS EAS

Can Analog Make A Comeback?
By Brian Bailey - 09 Jun, 2022 - Comments: 3

We live in an analog world dominated by digital processing, but that could change. Domain specificity, and the desire for greater levels of optimization, may provide analog compute with some significant advantages — and the possibility of a comeback. For the last four decades, the advantages of digital scaling and flexibility have pushed the dividing line between analog and digital closer ... » read more

Active Learning: Integrating Natural Intelligence Into Artificial Intelligence
By Oliver Gnepper - 09 Jun, 2022 - Comments: 0

Today, very few people would likely deny the fact that data can present major added value for companies. But analyzing data from production processes reveals the incompleteness of data collection and the associated reduced potential of the data that can be leveraged. Typical shortcomings include: Incomplete representation of processes in the dataspace, Inadequate connection of processes... » read more

Machine Learning-Based Optimization Of Chiral Photonic Nanostructures: Evolution- And Neural Network-Based Design
By Fraunhofer IIS/EAS - 08 Jun, 2022 - Comments: 0

Chiral photonics opens new pathways to manipulate light-matter interactions and tailor the optical response of metasurfaces and -materials by nanostructuring nontrivial patterns. Chirality of matter, such as that of molecules, and light, which in the simplest case is given by the handedness of circular polarization, have attracted much attention for applications in chemistry, nanophotonics and ... » read more

Keeping IC Packages Cool
By Laura Peters and Karen Heyman - 07 Jun, 2022 - Comments: 0

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 27 May, 2022 - Comments: 0

Automotive, mobility Cadence is now an official technology partner of the McLaren Formula 1 Team. The team will use Cadence’s Fidelity CFD Software to look at the computational fluid dynamics (CFD) of the airflow around the race cars and predict how a car design will affect the airflow. Infineon uncorked its XENSIV 60 GHz automotive radar sensor for in-cabin monitoring systems. One use ca... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 13 May, 2022 - Comments: 0

Automotive, mobility Fraunhofer IIS has opened a five-kilometer (3.11-mile) 5G test bed for automotive 5G applications near the city of Rosenheim in Bavaria, Germany. A closed 5G network with multiple base stations covers the test track, where connected cars can be tested under real conditions. “The automotive test bed is designed specially for developers and users that want to test new conn... » read more

Chiplets: Current Status
By Andy Heinig - 12 May, 2022 - Comments: 0

Recent weeks have seen a number of interesting developments in the area of chiplets. An increasing number of products based on chiplets have been brought to market, especially in the processors segment. For example, Apple and AMD now have processors with chiplets on the market and under production in high volumes. On one hand, this means that sufficient production capacity has now been built up... » read more

State-Space Model Of An Electro-Mechanical-Acoustic Contactless Energy Transfer System Based On Multiphysics Networks
By Fraunhofer IIS/EAS - 11 May, 2022 - Comments: 0

Contactless energy transfer systems are mainly divided into acoustic, inductive, capacitive and optical, in which main applications are related to biomedical, wireless chargers and sensors in metal enclosures. When solids are used as transfer media, ultrasound transducers based on piezoelectricity can be used for through-wall power transfer, which can be named as electro-mechanical-acoustic con... » read more

The Challenges Of Incremental Verification
By Brian Bailey - 28 Apr, 2022 - Comments: 1

Verification consumes more time and resources than design, and yet little headway is being made to optimize it. The reasons are complex, and there are more questions than there are answers. For example, what is the minimum verification required to gain confidence in a design change? How can you minimize the cost of finding out that the change was bad, or that it had unintended consequences? ... » read more

More Options, Less Dark Silicon
By Ed Sperling - 20 Apr, 2022 - Comments: 0

Chipmakers are beginning to re-examine how much dark silicon should be used in a heterogenous system, where it works best, and what alternatives are available — a direct result of a slowdown in Moore's Law scaling and the increasing disaggregation of SoCs. The concept of dark silicon has been around for a couple decades, but it really began taking off with the introduction of the Internet ... » read more

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