tag: Fraunhofer IIS EAS

Programming Processors In Heterogeneous Architectures
By Ann Mutschler - 08 Jun, 2023 - Comments: 0

Programming processors is becoming more complicated as more and different types of processing elements are included in the same architecture. While systems architects may revel in the number of options available for improving power, performance, and area, the challenge of programming functionality and making it all work together is turning out to be a major challenge. It involves multiple pr... » read more

Fast Time-To-Digital Converters As Ultra-Precise Stopwatches For Quantum Technologies
By Kay-Uwe Giering - 08 Jun, 2023 - Comments: 0

Quantum technologies enable versatile novel applications in modern engineering topics such as information processing, communication or sensing. In particular, photonic quantum technologies are an innovative field of development which, based on the quantization of light, implements a qubit for example in the polarization or phase of a single photon, or in other degrees of freedom of the electrom... » read more

Chiplet Planning Kicks Into High Gear
By Ann Mutschler - 25 May, 2023 - Comments: 0

Chiplets are beginning to impact chip design, even though they are not yet mainstream and no commercial marketplace exists for this kind of hardened IP. There are ongoing discussions about silicon lifecycle management, the best way to characterize and connect these devices, and how to deal with such issues as uneven aging and thermal mismatch. In addition, a big effort is underway to improve... » read more

Circuit Design For Industry 4.0
By Bjorn Zeugmann - 11 May, 2023 - Comments: 0

By Björn Zeugmann and Olaf Enge-Rosenblatt The digitalization of industry is progressing in leaps and bounds, albeit not at the same speed everywhere. In many industries, processes can be digitalized well to very well — for example, because electronic control systems can be retrofitted from analog to digital relatively easily. In some cases, new industries emerge only because processes ha... » read more

Week In Review: Design, Low Power
By Jesse Allen - 28 Apr, 2023 - Comments: 0

The National Institute of Standards and Technology (NIST) outlined its plan for a National Semiconductor Technology Center (NSTC) to be created using a share of the $11 billion in funds from the CHIPS Act marked for research and development. While a large portion of the CHIPS Act investment is set to boost U.S. fabs and manufacturing capabilities, the NSTC aims to also support the design side, ... » read more

Chiplets: More Standards Needed
By Andy Heinig - 13 Apr, 2023 - Comments: 1

Recent months have seen new advances in chiplet standardization. For example, consortia such as Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) have made progress in developing standards for die-to-die (D2D) interfaces in a chiplet’s design. Far from being a new phenomenon in communication, these types of standards are established for all forms of wired and wireless com... » read more

Generating the Generator: A User-Driven And Template-Based Approach Towards Analog Layout Automation
By Fraunhofer IIS/EAS - 12 Apr, 2023 - Comments: 0

Various analog design automation attempts have addressed the shortcomings of the still largely manual and, thus, inefficient and risky analog design approach. These methods can roughly be divided into synthesis and procedural generation. An important key aspect has, however, rarely been considered: usability. While synthesis requires sophisticated constraints, procedural generators require expe... » read more

Mechanical Challenges Rise With Heterogeneous Integration
By Ed Sperling - 03 Apr, 2023 - Comments: 0

Companies integrating multiple chips or chiplets into a package will need to address structural and other mechanical engineering issues, but gaps in the design tools, new materials and interconnect technologies, and a shortage of expertise are making it difficult to address those issues. Throughout most of the history of the semiconductors, few people outside of foundries worried about struc... » read more

Trusted Sensor Technology For The Internet Of Things
By Dirk Mayer - 27 Mar, 2023 - Comments: 0

“Data is the new oil” — Clive Humby, 2006 While this prediction relates to the value that can be generated from data, the focus here is on the tools at the oil well. Just as oil drilling platforms are expected to reliably produce crude oil around the clock, sensors are expected to reliably and continuously deliver high-quality data. But sensors have long since evolved from simple me... » read more

True 3D Is Much Tougher Than 2.5D
By Brian Bailey - 23 Mar, 2023 - Comments: 0

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D designs, there are multiple interpretations about what 3D entails. This is more than just semantics, however, because each packaging option requires different design approaches and technologies. And a... » read more

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