tag: Fraunhofer IIS/EAS

Chip Design Shifts As Fundamental Laws Run Out Of Steam
By Ann Mutschler - 31 Oct, 2022 - Comments: 12

Dennard scaling is gone, Amdahl's Law is reaching its limit, and Moore's Law is becoming difficult and expensive to follow, particularly as power and performance benefits diminish. And while none of that has reduced opportunities for much faster, lower-power chips, it has significantly shifted the dynamics for their design and manufacturing. Rather than just different process nodes and half ... » read more

Detection Of Electric Vehicles And Photovoltaic Systems In Smart Meter Data
By Fraunhofer IIS/EAS - 12 Oct, 2022 - Comments: 0

In the course of the switch to renewable energy sources, there is a shift from a few large energy sources (power plants) to a large number of small, distributed energy sources (e.g., photovoltaic systems) and energy storage devices (e.g., electric vehicles). This results in the need to know and identify these energy sources and sinks as soon as new devices are installed, in order to ensure grid... » read more

Microelectronics For Quantum Technologies
By Kay-Uwe Giering - 13 Sep, 2022 - Comments: 0

By Kay-Uwe Giering and Andy Heinig The transition of the quantum mechanics realm into engineering applications is opening up a large number of disruptive quantum technological opportunities. Their success relies on the recent technological advancements, which enable the controlled creation of individual quantum mechanical systems as well as their direct manipulation and measurement. Quantum ... » read more

Designing For Thermal
By Karen Heyman - 13 Sep, 2022 - Comments: 0

Heat has emerged as a major concern for semiconductors in every form factor, from digital watches to data centers, and it is becoming more of a problem at advanced nodes and in advanced packages where that heat is especially difficult to dissipate. Temperatures at the base of finFETs and GAA FETs can differ from those at the top of the transistor structures. They also can vary depending on h... » read more

A Multi-Level Analog IC Design Flow For Fast Performance Estimation Using Template-Based Layout Generators And Structural Models
By Fraunhofer IIS/EAS - 12 Sep, 2022 - Comments: 0

Analog IC design is a very challenging task as essential information is missing in the early design stages. Because the simulation of larger designs is exceedingly computationally expensive at lower abstraction levels, conservative assumptions are usually applied that often result in suboptimal performances such as area and power consumption. In order to enable both early performance estimates ... » read more

Making 5G More Reliable
By Ed Sperling - 08 Sep, 2022 - Comments: 0

The rollout of 5G is a complex and monumental effort involving multiple separate systems that need to function flawlessly together in real-time, making it difficult to determine where problems might arise, or how and when to test for them. Investments in 5G have been underway for the better part of a decade, and the technology is considered the next huge growth opportunity for mobile devices... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 26 Aug, 2022 - Comments: 0

Automotive, mobility California will ban the sale of new gasoline vehicles so that by 2035 100% of new cars and light trucks sold in California will be zero-emission vehicles. NXP Semiconductors announced multi-year supply agreements for its S32 family. Agreements to supply the S32 domain and zonal automotive processors to OEMs will include upcoming 5nm ASIL-D processors. Keysight Techno... » read more

New Uses For AI In Chips
By John Koon and Ed Sperling - 11 Aug, 2022 - Comments: 1

Artificial intelligence is being deployed across a number of new applications, from improving performance and reducing power in a wide range of end devices to spotting irregularities in data movement for security reasons. While most people are familiar with using machine learning and deep learning to distinguish between cats and dogs, emerging applications show how this capability can be use... » read more

The Reliability Of Analog Integrated Circuits And Their Simulation-Aided Verification
By Andre Lange - 19 Jul, 2022 - Comments: 0

Different challenges have to be overcome when designing integrated circuits. Besides schematic and layout design work, verification in view of the non-ideal behavior of circuits and semiconductor technologies in particular is also relevant. The designed circuits have to work at specific operating voltages and within ambient temperature ranges and be robust in terms of process fluctuations ... » read more

Heterogenous Integration Creating New IP Opportunities
By Brian Bailey - 19 Jul, 2022 - Comments: 0

The design IP market has long been known for constant change and evolution, but the industry trend toward heterogenous integration and chiplets is creating some new challenges and opportunities. Companies wanting to stake out a claim in this area have to be nimble, because there will be many potential standards introduced, and they are likely to change quickly as the industry explores what is r... » read more

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