Creating Airgaps To Reduce Parasitic Capacitance In FEOL

By Sumant Sarkar - 17 Nov, 2022 - Comments: 0

Reducing the parasitic capacitance between the gate metal and the source/drain contact of a transistor can decrease device switching delays. One way to reduce parasitic capacitance is to reduce the effective dielectric constant of the material layers between the gate and source/drain. This can be done by creating airgaps in the dielectric material at that location. This type of work has been do... » read more

More Manufacturing Issues, More Testing

By Ed Sperling - 08 Feb, 2022 - Comments: 0

Douglas Lefever, CEO of Advantest America, sat down with Semiconductor Engineering to talk about changes in test, the impact of advanced packaging, and business changes that are happening across the flow. What follows are excerpts of that discussion. SE: What are the big changes ahead in test? Lefever: It's less about inflection points and more like moving from algebra to calculus in the ... » read more

Battling Fab Cycle Times

By Mark LaPedus - 16 Feb, 2017 - Comments: 9

The shift from planar devices to finFETs enables chipmakers to scale their processes and devices from 16nm/14nm and beyond, but the industry faces several challenges at each node. Cost and technical issues are the obvious challenges. In addition, cycle time—a key but less publicized part of the chip-scaling equation—also is increasing at every turn, creating more angst for chipmakers and... » read more

Creating An Accurate FEOL CMP Model

By Jeff Wilson - 20 Oct, 2016 - Comments: 0

By Ruben Ghulghazaryan, Jeff Wilson, and Ahmed AbouZeid For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP modeling allows design and manufacturing teams to find and fix potential planarization issues before the actual CMP process is applied to a ... » read more

The Fill Ecosystem Evolves Again

By Jeff Wilson - 23 Jul, 2015 - Comments: 0

Several years ago, we wrote about the ecosystem of fill, and how 20nm technology required a much tighter relationship between the foundry, designers and EDA vendors. While the players remain the same, there have been some interesting shifts in fill techniques and usage as designers move to even-smaller technologies. What continues with each node is the additional complexity of the design flo... » read more

Ion Implanter Market Heats Up

By Mark LaPedus - 14 Aug, 2014 - Comments: 0

The ion implanter market has been a stable, if not a sleepy, business. The last big event took place in 2011, when Applied Materials re-entered the ion implanter market by acquiring Varian, the world’s leading supplier of these tools. The acquisition gave Applied Materials a commanding 80% share of the implanter business, with the other players fighting for the crumbs. But after year... » read more

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Creating Airgaps To Reduce Parasitic Capacitance In FEOL

More Manufacturing Issues, More Testing

Battling Fab Cycle Times

Creating An Accurate FEOL CMP Model

The Fill Ecosystem Evolves Again

Ion Implanter Market Heats Up

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