The Week In Review: Design

By Ed Sperling - 21 Feb, 2014 - Comments: 0

Synopsys inked a deal to acquire Coverity, a San Francisco-based security startup that builds tools to test source code for defects and security risks, for $375 million. The purchase price is $350 million plus another $25 million in debt. The deal is expected to close in Synopsys’ fiscal Q2. The company announced its financial results for fiscal Q1 ended Jan. 31, as well. Revenue was $479.0 m... » read more

The Week In Review: Manufacturing & Design

By Mark LaPedus - 06 Dec, 2013 - Comments: 0

A new study reveals that a majority of Americans are making some costly miscalculations regarding the performance of their existing PCs. The survey reveals that Americans lack financial savvy when faced with slow computers. Germany’s Merck KGaA, a pharmaceutical, chemical and life science company, announced an agreement with AZ Electronic Materials, under which Merck KGaA would acquire AZ.... » read more

The GaN Plan

By Ann Mutschler - 08 Apr, 2010 - Comments: 0

By Ann Steffora Mutschler Given the need to control power in high-end market segments such as servers, notebooks, mobile handsets and wired communications equipment, the market for gallium nitride (GaN)-based chips is poised for explosive growth. Case in point: Server farms are using more and more electricity, and the cost of that power is getting to be a significant fraction of the operati... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: gallium nitride

The Week In Review: Design

The Week In Review: Manufacturing & Design

The GaN Plan