Inspecting Unpatterned Wafers


Unpatterned wafer inspection, which has flown well under the radar for most of the semiconductor industry, is becoming more critical amid the need to find defects earlier in the manufacturing process flow. Finding those defects is getting harder as critical dimensions shrink. It's more difficult to actually detect smaller defects on bare wafers, there is more data to process, and there is mo... » read more

Mixed Outlook For Semi Biz


Both the IC and fab equipment industries have been enjoying a boom cycle for some time, but they could be facing speed bumps and possibly turbulence in the second half of this year and into 2019. In the first half of 2018, the industry was fueled by the momentum carried over from 2017. DRAM prices remained relatively high, which contributed to the revenue growth in the overall IC industry. M... » read more

Energy At The Edge


Ever since the first mention of the IoT, everyone assumed there would be billions of highly efficient battery-powered devices that drew milliwatts of energy. As it turns out, we are about to head down a rather different path. The enormous amount of data that will be gathered by sensors everywhere cannot possibly be sent to the cloud for processing. The existing infrastructure cannot handle i... » read more

The Week In Review: Manufacturing


Chipmakers and OEMs Tesla Motors has been struggling to get its new electric car, the Model 3, out the door. And it recently implemented a layoff amid ongoing losses. But the struggling car maker could be in the midst of a rebound. “Based on our checks, we believe the perceived quality of Model 3s coming off the lines continue to improve relative to prior checks, and we view this as one of t... » read more

RF SOI Wars Begin


Several foundries are expanding their fab capacities for RF SOI processes amid huge demand and shortages of this technology for smartphones. A number of foundries are increasing their 200mm RF SOI fab capacities to meet soaring demand. Then, GlobalFoundries, TowerJazz, TSMC and UMC are expanding or bringing up RF SOI processes in 300mm fabs in an apparent race to garner the first wave of RF ... » read more

The Week In Review: Manufacturing


Chipmakers Consumers recently filed a class-action suit against the three DRAM makers, alleging that they illegally agreed to raise prices for their respective memory products. The suit, filed in the U.S. District Court for the Northern District of California, alleges that Samsung, Micron and Hynix agreed to limit the supply of DRAM, driving up prices for this widely used memory. The pr... » read more

New Patterning Options Emerging


Several fab tool vendors are rolling out the next wave of self-aligned patterning technologies amid the shift toward new devices at 10/7nm and beyond. Applied Materials, Lam Research and TEL are developing self-aligned technologies based on a variety of new approaches. The latest approach involves self-aligned patterning techniques with multi-color material schemes, which are designed for us... » read more

Processing Moves To The Edge


Edge computing is evolving from a relatively obscure concept into an increasingly complex component of a distributed computing architecture, in which processing is being shifted toward end devices and satellite data facilities and away from the cloud. Edge computing has gained attention in two main areas. One is the [getkc id="78" kc_name="industrial IoT"], where it serves as a do-it-yoursel... » read more

The Week in Review: IoT


Cybersecurity The United Kingdom government issued a policy report, Secure by Design, calling on Internet of Things device manufacturers to eliminate default passwords, to provide greater transparency in vulnerability disclosure, and to secure credential storage. The report urges shifting cybersecurity responsibility to IoT device vendors, rather than end-users, and protecting the privacy righ... » read more

Multiphysics Reliability Signoff For Next-Gen Auto Electronics Systems


The automotive industry is in the midst of a sea change. Growing market needs for electrification, connectivity on the go, advanced driver assistance systems, and ultimately the goal of autonomous driving, are creating newer requirements and greater challenges. A chassis on four wheels is now fitted with cameras, radar and other sensors, which will be the eyes of the driverless car, as well as ... » read more

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