China Speeds Up Advanced Chip Development


China is accelerating its efforts to advance its domestic semiconductor industry, amid ongoing trade tensions with the West, in hopes of becoming more self-sufficient. The country is still behind in IC technology and is nowhere close to being self-reliant, but it is making noticeable progress. Until recently, China’s domestic chipmakers were stuck with mature foundry processes with no pres... » read more

Pandemics And Panic Chip Buying


U.S.-China trade tensions are creating uncertainty in the semiconductor market, but it is also causing another event right now—panic chip buying. At present, some but not all foundry vendors are seeing “rush orders” for select products and are running their fabs at full capacity. It’s not just leading-edge devices, but also mature technologies. A surge of chip orders started in Ma... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Imagination Technologies and BAIC Capital have formed an automotive joint venture to create a new automotive fabless semiconductor company focused on China as a client. The JV will be headquartered in the Zhongguancun Integrated Circuit Design Park in Beijing, China, with Bravo Lee serving as CEO. The JV will license IP and software from Imagination to create automotive-grade SoCs. ... » read more

Week In Review: Design, Low Power


Tools & IP Codasip unveiled its Codasip SweRV Core EH1 Support Package, which provides support for Western Digital's open source RISC-V-based core. The support package provides a comprehensive set of tools and components needed to design, implement, test, and write software for a SweRV Core-based SoC with support for leading EDA open and commercial flows. A free basic version is available ... » read more

Improving EUV Process Efficiency


The semiconductor industry is rethinking the manufacturing flow for extreme ultraviolet (EUV) lithography in an effort to improve the overall process and reduce waste in the fab. Vendors currently are developing new and potentially breakthrough fab materials and equipment. Those technologies are still in R&D and have yet to be proven. But if they work as planned, they could boost the flo... » read more

Week In Review: Manufacturing, Test


SPIE At the SPIE Advanced Lithography conference, Lam Research has introduced a new dry resist technology for extreme ultraviolet (EUV) lithography. Dry resist technology is a new approach to deposit and develop EUV resists. It is a dry deposition technique with alternate compositions and mechanisms. By combining Lam’s deposition and etch process expertise with partnerships with ASML a... » read more

2020 IC Outlook: Uncertainty


After a downturn in 2019, the semiconductor and equipment industries looked promising at the start of 2020. In 2019, the downturn was primarily due to the memory markets, namely DRAM and NAND. Both DRAM and NAND saw lackluster demand and falling prices last year. At the start of 2020, though, the memory markets were beginning to recover. Unlike memory, the logic and foundry markets were s... » read more

MOCVD Vendors Eye New Apps


Several equipment makers are developing or ramping up new metalorganic chemical vapor deposition (MOCVD) systems in the market, hoping to capture the next wave of growth applications in the arena. Competition is fierce among the various MOCVD equipment suppliers in the market, namely Aixtron, AMEC and Veeco. In addition, MOCVD equipment suppliers are looking for renewed growth in 2020, but b... » read more

Week In Review: Manufacturing, Test


Market research What are the hot chip markets for 2020? IC Insights released its rankings of sales growth rates for each of the 33 IC product categories defined by the World Semiconductor Trade Statistics (WSTS) organization. “After posting the two worst growth rates among all IC product categories in 2019, NAND flash and DRAM are forecast to be among the top three fastest-growing IC segment... » read more

5/3nm Wars Begin


Several foundries are ramping up their new 5nm processes in the market, but now customers must decide whether to design their next chips around the current transistor type or move to a different one at 3nm and beyond. The decision involves the move to extend today’s finFETs to 3nm, or to implement a new technology called gate-all-around FETs (GAA FETs) at 3nm or 2nm. An evolutionary step f... » read more

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