tag: Gartner

Inside Advanced Packaging
By Mark LaPedus - 18 Feb, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced IC-packaging, the OSAT industry, China and other topics with Ron Huemoeller, vice president of worldwide R&D at Amkor. What follows are excerpts of that conversation. SE: Where are we in advanced IC-packaging today? Huemoeller: We’ve hit the inflection point. Now we are coming to the other side of it. Regarding this need to int... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 Feb, 2016 - Comments: 0

Samsung introduced inFlux, a new lineup of high-flux, linear LED modules optimized for industrial lighting applications such as plants, parking lots and warehouses. The LED modules serve as a replacement for conventional T8 and T5HO tubes and are suitable for high-flux LED luminaires covering up to 40,000lm. The semiconductor market is off to a slow start in 2016. And it might be a long yea... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jan, 2016 - Comments: 0

Qualcomm recently announced the new Snapdragon 820. The cell-phone chipset is based on Samsung Electronics’ new 14nm LPP (Low-Power Plus) process, the second-generation of the company’s 14nm finFET process technology. What’s next? Qualcomm is developing the Snapdragon 830. “Snapdragon 830 leaks indicate that the chip will sport 8GB of RAM, an enhanced Kryo custom architecture, and fabbe... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Jan, 2016 - Comments: 0

Samsung Electronics announced that it has begun producing the industry’s first 4-gigabyte DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface. The 4GB HBM2 package is created by stacking a buffer die at the bottom and four 8-gigabit core dies on top. These are then vertically interconnected by TSV holes and microbumps. A single 8Gb HBM2 die contains over 5,000 T... » read more

Will 5nm Happen?
By Mark LaPedus - 20 Jan, 2016 - Comments: 7

Chipmakers are ramping up their 16/14nm finFET processes, with 10nm finFETs expected to ship sometime in late 2016 or early 2017. So what’s next? The foundries can see a path to extend the finFET transistor to 7nm, but the next node, 5nm, is far from certain and may never happen. Indeed, there are several technical and economic challenges at 5nm. And even if 5nm happens, only a few compani... » read more

Interference In The Car
By Ernest Worthman - 07 Jan, 2016 - Comments: 0

Once again, a paradigm shift is upon us. Mobile connectivity has radically changed the automobile’s place in the world of connected everything. And that paradigm will shift even further once the IoE is in full bloom. As all of this unfolds and technology marches on, some see the connectivity of the automobile as being a better and more powerful alternative to the smartphone. It is touted a... » read more

Foundries Face Challenges in 2016
By Mark LaPedus - 17 Dec, 2015 - Comments: 2

Generally, 2015 has been a challenging year in the foundry business. For one thing, the foundry industry will register modest growth in 2015. In addition, the foundry customer base is consolidating. And on the leading edge, foundries took longer than expected to ramp up their 16nm/14nm finFET processes. So, after an eventful year in 2015, what’s in store for the foundry business in 2016? I... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Dec, 2015 - Comments: 0

In 2015, Korea outspent all other countries ($9 billion) on front-end semiconductor fab equipment, according to SEMI. But Korea is expected to drop to second place in 2016, as Taiwan takes over with the largest CapEx spending at $8.3 billion, according to SEMI. In 2015, Americas ranked third in overall regional CapEx spending with about $5.6 billion and is forecast to increase only slightly to ... » read more

Counting By The Billions
By Ed Sperling - 29 Oct, 2015 - Comments: 1

The semiconductor industry has been on cruise control since the advent of the personal computer. By 2002, a total of 1 billion PCs had been shipped, according to Gartner, and by 2008 that number had doubled. But that was nothing compared with the smartphone. In 2014 alone, Gartner reported sales of 1.2 billion smartphones. Both of those markets will remain healthy for years to come. Despite... » read more

Lam To Acquire KLA-Tencor
By Mark LaPedus - 21 Oct, 2015 - Comments: 1

In a major and surprising move in the fab tool business, Lam Research has entered into a definitive agreement to acquire KLA-Tencor for about $10.6 billion in cash and stock. Lam’s proposed move to acquire KLA-Tencor would create a powerhouse in the fab tool industry. The combined company will have approximately $8.7 billion in annual revenue, propelling it to become the world’s second l... » read more

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