tag: Gartner

Atomic Layer Etch Heats Up
By Mark LaPedus - 29 Jun, 2016 - Comments: 0

The atomic layer etch (ALE) market is starting to heat up as chipmakers push to 10nm and beyond. ALE is a promising next-generation etch technology that has been in R&D for the last several years, but until now there has been little or no need to use it. Unlike conventional etch tools, which remove materials on a continuous basis, ALE promises to selectively and precisely remove targete... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Jun, 2016 - Comments: 0

Chipmakers It’s been a difficult time for Intel. The chip giant recently announced a major layoff. It also ceased development on several cell-phone chip products. Intel hasn’t given up on Moore’s Law, but the nodes appear to be extending from 18 to 24 months or perhaps longer, at least at Intel. Here’s the latest: For 10nm production, Intel received the production fab tools in Ap... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Jun, 2016 - Comments: 0

Chipmakers Through a joint venture with the government of Chongqing, GlobalFoundries will take over an existing 200mm fab in China. Then, GlobalFoundries plans to retrofit the facility and turn it into a 300mm fab. The foundry vendor is transferring its 180nm and 130nm processes to the China fab. Meanwhile, TSMC, UMC and others are also building fabs in China. Samsung Electronics has begu... » read more

The Week In Review: IoT
By Jeff Dorsch - 27 May, 2016 - Comments: 0

Tools Mentor Graphics rolled out a tester for thermal reliability of electric and hybrid vehicles during power cycling. The tester is the first of its kind. Deals Rambus signed a deal with Eurobank Poland for a cloud-based mobile payment system. The deal involves Secure Element in the Cloud software from Bell ID, which Rambus acquired in January. Eurobank Poland has more than 1 million cus... » read more

The Mightier Microcontroller
By Ed Sperling - 26 May, 2016 - Comments: 1

Microcontrollers are becoming more complex, more powerful, and significantly more useful, but those improvements come with strings attached. While it's relatively straightforward to develop multi-core microcontroller (MCU) hardware with advanced power management features, it's much more difficult to write software for these chips because memory is limited. CPUs can use on-chip memory such as... » read more

How To Make 3D NAND
By Mark LaPedus - 23 May, 2016 - Comments: 0

In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND. 3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

What’s The Outlook For ICs?
By Mark LaPedus - 19 May, 2016 - Comments: 1

As the semiconductor industry heads into the second half of 2016, it’s time to take the pulse of the IC sector. Based on the current signs, there’s a faint pulse, if that. Simply put, the IC market has been in the doldrums in the first half of 2016. And it looks sluggish heading into the second half. It wasn’t supposed to be like this. At the beginning of this year, many predicte... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 May, 2016 - Comments: 0

Chipmakers Samsung Electronics has unveiled its newest memory card globally–the EVO Plus 256GB microSD card. Based on Samsung’s 3D NAND technology, the EVO Plus 256-GB offers the highest capacity for a microSD card in its class. Consumers can now record up to 12 hours of 4K UHD video or 33 hours of Full HD video on their mobile device or action camera without needing to change or replace t... » read more

10nm Versus 7nm
By Mark LaPedus - 25 Apr, 2016 - Comments: 20

The silicon foundry business is heating up, as vendors continue to ramp their 16nm/14nm finFET processes. At the same time, they are racing each other to ship the next technologies on the roadmap—10nm and 7nm. But the landscape is complicated, with each vendor taking a different strategy. [getentity id="22865" e_name="Samsung"], for one, plans to ship its 10nm [getkc id="185" kc_name="fi... » read more

7nm Fab Challenges
By Mark LaPedus - 21 Apr, 2016 - Comments: 3

Leading-edge foundry vendors have made the challenging transition from traditional planar processes into the finFET transistor era. The first [getkc id="185" kc_name="finFETs"] were based on the 22nm node, and now the industry is ramping up 16nm/14nm technologies. Going forward, the question is how far the finFET can be scaled. In fact, 10nm finFETs from Samsung are expected to ramp by ye... » read more

← Older posts Newer posts →

  • Sponsors

  • Standards/Organizations

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy