tag: GE

Context Is Everything
By Ann Mutschler - 29 Aug, 2016 - Comments: 0

With consumer and industrial IoT applications, the importance of system context to IC vendors is paramount. No more are the days of developing a chip in isolation; close partnership with systems companies is de rigueur as they provide the use case data that is foundational to development of systems that work. While this makes sense in a smartphone, it’s significantly harder to achieve in a... » read more

The Week in Review: IoT
By Jeff Dorsch - 22 Jul, 2016 - Comments: 0

Deals The big news of the week, of course, is SoftBank Group’s proposed acquisition of ARM Holdings for a breathtaking $32.2 billion in cash. In announcing the deal, the companies made it abundantly clear that the proposed acquisition is chiefly about Internet of Things technology. “When I think about the investment and the commitment that’s going to be required to develop the future te... » read more

The Week In Review: IoT
By Jeff Dorsch - 01 Jul, 2016 - Comments: 0

Deals Rambus agreed to acquire the assets of Inphi’s Memory Interconnect Business for $90 million in cash. Under the usual closing conditions, the transaction is scheduled to conclude during the third quarter. The business assets take in customer contracts, intellectual property, product inventory, and supply-chain agreements. “By combining our buffer chip team with the Memory Interconnect... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 May, 2016 - Comments: 0

Chipmakers IC Insights released its top chip makers in terms of sales for the first quarter of 2016. The top-20 ranking includes three pure-play foundries (TSMC, GlobalFoundries, and UMC) and six fabless companies. Intel remained in the top spot, followed in order by Samsung and TSMC. The biggest movers in the ranking were made by the new Broadcom (Avago/Broadcom) and Nvidia. Broadcom jumped f... » read more

Still Waiting For III-V Chips
By Mark LaPedus - 19 Feb, 2015 - Comments: 0

For years, chipmakers have been searching for an alternative material to replace traditional silicon in the channel for advanced CMOS devices at 7nm and beyond. There’s a good reason, too: At 7nm, silicon will likely run out of steam in the channel. Until recently, chipmakers were counting on III-V materials for the channels, at least for NFET. Compared to silicon, III-V materials provide ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 18 Jul, 2014 - Comments: 0

IBM’s move to sell its chip business to GlobalFoundries may have stalled or is dead, according to the Albany Times Union and other news outlets. New York Governor Andrew Cuomo announced that the state will partner with over 100 private companies, led by GE, to launch the New York Power Electronics Manufacturing Consortium. GE will be a lead partner in a fab, housed at the CNSE Nano Tech co... » read more

Do Students Need More Formal Education?
By Brian Bailey - 21 Nov, 2013 - Comments: 0

A few weeks ago, some of the top researchers and practitioners in the area of formal methods converged on Portland, Oregon. The event was the annual Formal Methods in Computer-Aided Design (FMCAD) conference and Semiconductor Engineering attended the panel titled “Teaching Formal Methods: Needs, Challenges, Experiences, and Opportunities.” Panelists included: Jason Baumgartner, formal verif... » read more

OLED Displacing LCD, But Not Affecting Industry Leaders
By Michael Watts - 25 Jun, 2013 - Comments: 0

By Michael P.C. Watts One of the most common themes in high tech is how companies fail to deal with game-changing new products. Think about Kodak and digital cameras, Sony and the flash memory music player, Microsoft and the tablet, GE and Osram and the Light Emitting Diode (LED). The overwhelming conclusion seems to be that you have to be committed to making your own most valuable product red... » read more

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