Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 17 Feb, 2023 - Comments: 0

Tesla will recall 362,000 U.S. vehicles over Full Self-Driving (FSD) Beta software after the National Highway Traffic Safety Administration (NHTSA) found that the cars sometimes have unsafe behavior around intersections when using the FSD Beta system. Examples are “traveling straight through an intersection while in a turn-only lane, entering a stop sign-controlled intersection without coming... » read more

Towards Self-Driving Cars: MIPI D-PHY Enabling Advanced Automotive Applications

By Mixel - 09 Dec, 2020 - Comments: 0

Because both viewing and sensing ADAS applications must handle imaging, sensing, high-speed serial communication, and downstream processing functions, Camera Video Processors (CVPs) are always located at the heart of these systems. As more cameras and sensors are added to the system to aid in increasingly complicated tasks, more integrated CVP solutions are required. Ideally, these CVPs should ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 10 May, 2019 - Comments: 0

Internet of Things Microsoft this week introduced IoT Plug and Play, a no-code toolkit for connecting Internet of Things devices to the cloud. The company touts it as a new modeling language to pump up the capabilities of IoT devices through the Microsoft Azure cloud service. The Azure IoT Device Catalog lists devices that support IoT Plug and Play, such as the STMicroelectronics SensorTile.bo... » read more

The Week In Review: Design

By Jesse Allen - 02 Mar, 2018 - Comments: 0

Startup OnScale launched with advanced CAE multi-physics solvers that are seamlessly integrated with a scalable, high performance cloud computing platform built on Amazon's AWS. The company's model is built around a Solver-as-a-Service pay-as-you-go subscription model and targets 5G, IoT/Industrial IoT, biomedical, and autonomous car markets. The company has $3 million in strategic seed fund... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: GEO Semiconductor

Week In Review: Auto, Security, Pervasive Computing

Towards Self-Driving Cars: MIPI D-PHY Enabling Advanced Automotive Applications

Week in Review: IoT, Security, Auto

The Week In Review: Design

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Knowledge Centers
Entities, people and technologies explored