tag: GigaDevice

Chip Industry Week In Review
By The SE Staff - 22 Nov, 2024 - Comments: 0

SK hynix started mass production of 1-terabit  321-high NAND, with availability scheduled for the first half of next year. Rapidus will receive an additional ¥200 billion yen ($1.28B) from the Japanese government beginning in fiscal year 2025, reports Nikkei. This is on top of ¥920 billion yen ($5.98B) Rapidus has already received from the government in support of its goal to reach commer... » read more

Startup Funding: March 2023
By Jesse Allen - 05 Apr, 2023 - Comments: 0

Funding was broadly spread between sectors in March, with automotive edging ahead thanks to a more than $100 million round for a company manufacturing electric, autonomous heavy commercial trucks for freight logistics. To keep up with the amount of information presented by cars and ADAS, several companies raised funds for head-up displays with increasing levels of detail and expanded fields of ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Feb, 2022 - Comments: 0

Chipmakers Intel has announced a definitive agreement to acquire Tower, a specialty foundry vendor, for approximately $5.4 billion. With the acquisition of Tower, Intel expands its efforts in the foundry business, and put its rivals on notice. With Tower, Intel gains access to mature processes as well as specialty technologies, such as analog, CMOS image sensor, MEMS, power management and RF. ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 15 May, 2020 - Comments: 0

Tools & IP Synopsys released a range of IP for TSMC's 5nm process technology. It includes interface PHY IP such as 112G/56G Ethernet, Die-to-Die, PCIe 5.0, CXL, and CCIX; memory interface IP for DDR5, LPDDR5, and HBM2/2E; die-to-die PHYs for 112G USR/XSR connectivity and High-Bandwidth Interconnect; and foundation IP including logic libraries, multi-port memory compilers, and TCAMs. Sma... » read more

The Week In Review: Design
By Jesse Allen - 11 May, 2018 - Comments: 0

M&A IoT-focused memory chipmaker Adesto Technologies acquired S3 Semiconductors, a provider of mixed-signal and RF ASICs and IP. Based in Ireland, S3 Semiconductors was founded in 1986. S3 Semiconductors will become a business unit of Adesto and will continue to operate under its current model in the $35 million deal. S3 Semiconductor's parent company, S3 Group, will continue as a separate... » read more

Will China Succeed In Memory?
By Mark LaPedus - 19 Feb, 2018 - Comments: 5

China's fledging memory makers are expected to reach a major milestone and move into initial production this year, although vendors are already running into various roadblocks. China's domestic vendors are focusing on two markets, 3D NAND and DRAM. In both cases local vendors are either behind in technology, struggling to develop these products, or both. And one vendor recently was hit with ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Feb, 2018 - Comments: 0

Chipmakers China has struck again, as the nation continues to acquire semiconductor technology. In December, Silicon Labs announced plans to acquire Sigma Designs for $282 million. The deal involves Sigma’s Z-Wave chip business. Now, Sigma Designs has sold its connectivity chip business unit to Integrated Silicon Solution Inc. (ISSI). In 2015, a Chinese consortium of investors led by Uph... » read more

China Moves To Top Spot In Fab Equipment Spending
By Clark Tseng - 16 Feb, 2017 - Comments: 0

By Clark Tseng, Dan Tracy & Gavin Wang of SEMI With 20, and possibly more, new fab projects underway or announced in China since 2016, spending on fab equipment will surge to $10 billion or more, annually, by 2018 and to even higher levels in the following two years. As a result, China is projected to be the top spending region for fab equipment in 2019 and 2020. Robert Maire, of Semicon... » read more

China Unveils Memory Plans
By Mark LaPedus - 19 Jan, 2017 - Comments: 2

Backed by billions of dollars in government funding, China in 2014 launched a major initiative to advance its domestic semiconductor, IC-packaging and other electronic sectors. So far, though, the results are mixed. China is making progress in IC-packaging, but the nation’s efforts to advance its domestic logic and memory sectors are still a work in progress. In fact, China has yet to achi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Dec, 2016 - Comments: 0

Chipmakers Samsung is mulling over a plan to reorganize its System LSI division, according to a report from BusinessKorea. As part of the move, Samsung is mulling over the idea to spin off its foundry unit, according to the report. A spokeswoman for Samsung’s foundry unit said: “We don't have any comments on this story.” GlobalFoundries has added eight new partners to its FDXcelera... » read more

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