Focus Shifting From 2.5D To Fan-Outs For Lower Cost


Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

Non-Traditional Chips Gaining Steam


Flexible hybrid electronics are beginning to roll out in the form of medical devices, wearable electronics and even near-field communications tags in retail, setting the stage for a whole new wave of circuit design, manufacturing and packaging that reaches well beyond traditional chips. FHE devices begin with substrates made of ceramics, glass, plastic, polyimide, polymers, polysilicon, stai... » read more