tag: GlobalFoundries

22nm Process Technology
By Ed Sperling - 19 Jul, 2018 - Comments: 0

Jamie Shaeffer, senior director of product line management at GlobalFoundries, talks about how FD-SOI compares with bulk technologies, where it will be used and why, and future stacking options. https://youtu.be/2i7GJRxcNRs » read more

Moving To ASICs For ADAS
By Gary Dagastine - 19 Jul, 2018 - Comments: 0

By some estimates, there are now more than 260 startups and established companies around the world scrambling to develop, qualify and bring to market chips and technologies for new ADAS (advanced driver-assistance systems) and autonomous driving applications. Accordingly, venture capitalists, technology companies, carmakers, Tier 1 automotive suppliers and others are sharply ratcheting up ... » read more

5nm Design Progress
By Ann Mutschler - 17 Jul, 2018 - Comments: 1

Activity surrounding the 5nm manufacturing process node is quickly ramping, creating a better picture of the myriad and increasingly complex design issues that must be overcome. Progress at each new node after 28nm has required an increasingly tight partnership between the foundries, which are developing new processes and rule decks, along with EDA and IP vendors, which are adding tools, met... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Jul, 2018 - Comments: 0

Chipmakers GlobalFoundries said that the company’s 22nm FD-SOI technology has delivered more than $2 billion worth of client design win revenue. With more than 50 total client designs, the technology is designed for automotive, 5G connectivity and the Internet of Things (IoT). Helic has announced that its electromagnetic (EM) modeling engine has been certified for GlobalFoundries’ 22nm ... » read more

Bridges Vs. Interposers
By Mark LaPedus - 12 Jul, 2018 - Comments: 4

The number of technology options continue to grow for advanced packaging, including new and different ways to incorporate so-called silicon bridges in products. For some time, Intel has offered a silicon bridge technology called Embedded Multi-die Interconnect Bridge (EMIB), which makes use of a tiny piece of silicon with routing layers that connects one chip to another in an IC package. In ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Jun, 2018 - Comments: 0

Chipmakers and OEMs Fujitsu Semiconductor and United Microelectronics Corp. (UMC) announced that UMC will acquire all of the shares of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture between both companies. In addition to the 15.9% of MIFS shares currently owned by UMC, Fujitsu Semiconductor will transfer the remaining 84.1% of its shares in MIFS to UMC, making MI... » read more

Blog Review: June 27
By Jesse Allen - 27 Jun, 2018 - Comments: 0

Applied Materials' Sundeep Bajikar argues that to realize the full potential of AI, new computing architectures are necessary, otherwise AI will quickly become unaffordable. Synopsys' Iain Singleton considers why it may not always be necessary to start at the reset state during formal verification and how to use abstractions to get a head start on bug hunting. Cadence's Meera Collier look... » read more

Materials, Magnetism & Quantum Physics
By Ed Sperling - 21 Jun, 2018 - Comments: 0

For the past half-century, chipmakers have been following the same roadmap for improving performance in chips and reducing the cost of chips. That has proven tremendously effective in reducing costs and packing computing into a smaller space, allowing people to carry around what used to be a multi-million-dollar mainframe in their pocket. That approach is beginning to lose momentum. It's ge... » read more

System-In-Package Vs. eNVM
By Yafeng Zhang - 21 Jun, 2018 - Comments: 0

The booming automotive and IoT markets are driving increasing demand for microcontrollers (MCUs). Recent forecasts project that the overall MCU compound annual growth rate (CAGR) will reach 4% over the next five years, and in particular the automotive MCU CAGR could reach close to 14%. Non-volatile memory (NVM) is a critical element of MCUs, as it is needed not only to store the code, but al... » read more

Dealing With Resistance In Chips
By Mark LaPedus - 21 Jun, 2018 - Comments: 2

Chipmakers continue to scale the transistor at advanced nodes, but they are struggling to maintain the same pace with the other two critical parts of the device—the contacts and interconnects. That’s beginning to change, however. In fact, at 10nm/7nm, chipmakers are introducing new topologies and materials such as cobalt, which promises to boost the performance and reduce unwanted resist... » read more

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