The Week In Review: Manufacturing


Chipmakers IC Insights has released its rankings of the top 10 pure-play foundries in 2016. TSMC was the largest foundry in terms of sales, followed by GlobalFoundries, UMC, and SMIC, according to IC Insights. TSMC held a 59% share in 2016. According to IC Insights, the three top-10 pure-play foundry companies that displayed the highest growth rates in 2016 were X-Fab (54%), SMIC (31%) and To... » read more

IoT Security Risks Grow


Semiconductor Engineering sat down to discuss security issues with Asaf Shen, vice president of marketing for security IP in ARM's Systems & Software Group; Timothy Dry, principal staff marketing manager for the Industrial IoT segment at GlobalFoundries; Chowdary Yanamadala, senior vice president of business development at ChaoLogix; and Eric Sivertson, CEO of Quantum Trace. What follows ar... » read more

BEOL Issues At 10nm And 7nm (part 2)


Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for [getentity id="22819" e_name="GlobalFoundries'"] advanced technology development integration unit; Paul Besser, senior technology director at [getentity id="22820" comment="Lam Research"]; David Fried, CTO at [getentity id="22210" e_name... » read more

The Week In Review: Manufacturing


Chipmakers TDK has agreed to acquire MEMS supplier InvenSense for cash at an acquisition price of $13.00 per share, for a total acquisition price of $1.3 billion. Cypress has begun volume shipments of microcontrollers (MCUs) based on its 40nm Embedded Charge-Trap (eCT) flash technology. The MCUs are made on a foundry basis at UMC. UMC’s technology is a 40nm low power (40LP) logic process.... » read more

Foundries See Mixed Future


Amid a tumultuous business environment, the silicon foundry industry is projected to see steady growth in a number of process segments in 2017. As in past years, the foundry market is expected to grow faster than the overall IC industry in 2017. But at the same time, the IC industry—the foundry customer base—continues to witness a frenetic wave of merger and acquisition activity. Basical... » read more

Uncertainty Grows For 5nm, 3nm


As several chipmakers ramp up their 10nm finFET processes, with 7nm just around the corner, R&D has begun for 5nm and beyond. In fact, some are already moving full speed ahead in the arena. [getentity id="22586" comment="TSMC"] recently announced plans to build a new fab in Taiwan at a cost of $15.7 billion. The proposed fab is targeted to manufacture TSMC’s 5nm and 3nm processes, whic... » read more

The Week In Review: Manufacturing


Chipmakers Samsung is mulling over a plan to reorganize its System LSI division, according to a report from BusinessKorea. As part of the move, Samsung is mulling over the idea to spin off its foundry unit, according to the report. A spokeswoman for Samsung’s foundry unit said: “We don't have any comments on this story.” GlobalFoundries has added eight new partners to its FDXcelera... » read more

5 Takeaways from IEDM


As usual, the recent IEEE International Electron Devices Meeting (IEDM) was a busy week. The event, which took place in San Francisco, featured a plethora of subjects, such as next-generation transistors and memories. The event also included tracks on non-traditional approaches like quantum and neuromorphic computing. And then, there were sessions on power semis and others. In no partic... » read more

BEOL Issues At 10nm And 7nm (Part 1)


Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for [getentity id="22819" e_name="GlobalFoundries'"] advanced technology development integration unit; Paul Besser, senior technology director at [getentity id="22820" comment="Lam Research"]; David Fried, CTO at [getentity id="22210" e_name... » read more

Tech Talk: FD-SOI vs. FinFET


Jamie Schaeffer, 22FDX program director at GlobalFoundries, talks about the future of FD-SOI, what the tradeoffs are in performance, power and cost compared with finFETs, how many mask layers and patterning steps are required for each, and when 12nm FD-SOI will be introduced. Related Stories To 7nm And Beyond GlobalFoundries’ top technologists open up on next-gen FD-SOI, the economi... » read more

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