tag: GlobalFoundries

Memory Hierarchy Shakeup
By Mark LaPedus - 16 Sep, 2015 - Comments: 0

It’s no secret that today’s memory chips and storage devices are struggling to keep up with the growing demands in data processing. To solve the problem, chipmakers have been working on several next-generation memory types. But most technologies have been delayed or fallen short of their promises. But after numerous delays, a new wave of next-generation, nonvolatile memories are finally ... » read more

Challenges At Advanced Nodes
By Ed Sperling - 09 Sep, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss finFETs, 22nm FD-SOI and how the how the market will segment over the next few years with Marie Semeria, CEO of [getentity id="22192" e_name="Leti"]; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Paul Boudre, CEO of Soitec; and Subramani Kengeri, vice president of global ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 04 Sep, 2015 - Comments: 0

GlobalFoundries has partnered with Catena, a supplier of radio frequency (RF) communication IPs, to offer complete Wi-Fi and Bluetooth solutions for system-on-chip (SoC) designers targeting mobile, Internet-of-Things (IoT), RF connectivity markets. In addition, GlobalFoundries and QEOS are partnering to co-develop the industry’s first mmW CMOS platform. Samsung Electronics said that its 20... » read more

Electronics Butterfly Effect
By Brian Bailey - 27 Aug, 2015 - Comments: 1

Everyone has heard of the butterfly effect where a small change in a non-linear system can result in large difference in an outcome. For the past 40 years, the electronics industry has approximated a linear system, fed primarily by Moore’s Law. The incremental changes available at each new process node have led us to make incremental changes and improvements in many aspects of the design, its... » read more

Advanced IC Packaging Biz Heats Up
By Mark LaPedus - 20 Aug, 2015 - Comments: 0

After a number of false starts and lackluster adoption, the advanced IC packaging market is finally heating up. On one front, for example, a new wave of chips based on advanced [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] stacked-die is entering the market. And on another front, the momentum is building for new and advanced 2D packages, such as embedded package-on-package (PoP... » read more

Challenges At Advanced Nodes
By Ed Sperling - 19 Aug, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss finFETs, 22nm FD-SOI and how the how the market will segment over the next few years with Marie Semeria, CEO of [getentity id="22192" e_name="Leti"]; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Paul Boudre, CEO of Soitec; and Subramani Kengeri, vice president of global ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Aug, 2015 - Comments: 0

Sunit Rikhi, vice president of the Technology and Manufacturing Group at Intel and general manager of Intel’s Custom Foundry unit, has retired. “I left Intel on a sabbatical in late March and ended my career with Intel on June 1,” Rikhi said in an e-mail. Now, Rikhi has started a new company. The company, called Reach for Infinity LLC, “is a management development company devoted to... » read more

2.5D Creeps Into SoC Designs
By Ed Sperling - 13 Aug, 2015 - Comments: 0

A decade ago top chipmakers predicted that the next frontier for SoC architectures would be the z axis, adding a third dimension to improve throughput and performance, reduce congestion around memories, and reduce the amount of energy needed to drive signals. The obvious market for this was applications processors for mobile devices, and the first companies to jump on the stacked die bandwag... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 07 Aug, 2015 - Comments: 0

IC Insights released its top-20 chip rankings in terms of sales for the first half of 2015. Samsung’s growth rate in 2Q ‘15 put the company closer to catching Intel, the world’s largest chipmaker. IC Insights also showed how the top-20 rankings would have looked if the proposed Avago/Broadcom and NXP/Freescale mergers were in place. Avago/Broadcom would have been ranked 7th and NXP/Freesc... » read more

The Future Of Moore’s Law
By Ed Sperling - 03 Aug, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss the future of Moore's Law with Jan Rabaey, Donald O. Pederson distinguished professor at [getentity id="22165" comment="UC Berkeley"]; Lucio Lanza, managing director of Lanza techVentures; Subramani Kengeri, vice president of advanced technology architecture at [getentity id="22819" comment="GlobalFoundries"]; Charlie Cheng, CEO of [getentity id="2... » read more

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